RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
G3380K
4.5 W/m*K
Low minimum bond line
The primary function of thermal paste is to eliminate microscopic gaps and surface irregularities between components. Since air is a poor thermal conductor, these gaps hinder effective heat transfer. By filling these spaces, thermal paste significantly improves thermal conductivity, helping to efficiently dissipate waste heat generated by components such as the CPU to the heatsink. This prevents overheating, ensures system stability, and extends hardware lifespan.

CATEGORY

FEATURES

/ Thermal conductivity: 4.5 W/m*K
/ Low thermal impedance
/ Can be applied manually dispensed or screen printed
/ Low minimum bond line

CONFIGURATIONS

/ Tinplate Can: 1kg
/ Other special and custom sizes are available upon request

TYPICAL APPLICATION

/ LED appliance
/ EV electric vehicle
/ CPU and chip coolers
/ Switching power supplies
/ 5G base station & infrastructure
/ Between any heat-generating component and heat sink

TYPICAL PROPERTIES

PROPERTY G3380K UNIT TEST METHOD
Color Gray - Visual
Resin base Silicone - -
Filler Non-Metal - -
Viscosity 104 Pa.s ISO 3219
Density 2.7 g/cm³ ASTM D792
Application temperature -60~180 °C -
Bond line thickness 30 µm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 4.5 W/m*K ASTM D5470
Thermal impedance@50psi 0.02 °C-in²/ W ASTM D5470
Thermal impedance@50psi 12.9 °C-mm²/ W ASTM D5470

Related​ Product

G3380K
4.5 W/m*K
Low minimum bond line

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    熱介面管理專家

    LiPOLY® Advance TIMs

    桃園市八德區永豐路435號

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