RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

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G3380A
1.3 W/m·K
Low minimum bond line
The primary function of thermal paste is to fill the microscopic gaps between the CPU and the heatsink, improving thermal conductivity. It helps transfer the heat generated by the CPU quickly and efficiently to the heatsink, thereby lowering the CPU temperature and preventing system instability or damage caused by overheating.
Datasheet Download

CATEGORY

FEATURES

/ Thermal conductivity: 1.3 W/m·K
/ Low thermal impedance
/ Can be applied manually dispensed or screen printed
/ Low minimum bond line

CONFIGURATIONS

/ Tinplate Can:1kg
/ Other special and custom sizes are available upon request

TYPICAL APPLICATION

/ LED appliance
/ EV electric vehicle
/ CPU and chip coolers
/ Switching power supplies
/ 5G base station & infrastructure
/ Between any heat-generating component and a heat sink

TYPICAL PROPERTIES

PROPERTY G3380A UNIT TEST METHOD
Color White - Visual
Resin Base Silicone - -
Filler Non-Metal - -
Viscosity 16.5 Pa.s ISO 3219
Density 2.2 g/cm³ ASTM D792
Application temperature -60~180 °C -
Bond Line Thickness 55 µm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 1.3 W/m·K ASTM D5470
Thermal impedance@50psi 0.05 °C-in²/ W ASTM D5470
Thermal impedance@50psi 32.2 °C-mm²/ W ASTM D5470

Related Products

Thermal paste plays a crucial role in computer cooling. When processors (CPUs) or graphics cards (GPUs) operate continuously, they generate a significant amount of heat. If cooling performance is insufficient, it not only affects the overall performance of the computer but may also lead to system instability or crashes due to overheating.
TT3000
6.0 W/m·K
Nano Thermal Grease
After applying thermal paste to the surface of the CPU, it effectively eliminates excess air between the processor and the heatsink, enabling high-performance thermal conductivity. This allows the heat generated by the CPU to be transferred to the heatsink more quickly, thereby improving the overall cooling performance of the computer.
G3380T
6.0 W/m·K
Low minimum bond line
The primary function of thermal paste is to eliminate microscopic gaps and surface irregularities between components. Since air is a poor thermal conductor, these gaps hinder effective heat transfer. By filling these spaces, thermal paste significantly improves thermal conductivity, helping to efficiently dissipate waste heat generated by components such as the CPU to the heatsink. This prevents overheating, ensures system stability, and extends hardware lifespan.
G3380K
4.5 W/m·K
Low minimum bond line
The G3380B series thermal Paste features extremely low thermal resistance and excellent thermal conductivity. It has been widely used in thermal management for consumer electronics and microprocessors. As the temperature of components rises, the viscosity of the grease decreases, allowing it to better wet the interface components. With a thermal conductivity of 3.2 W/m*K, it serves as an effective gap-filling material.
G3380B
3.2 W/m·K
Low minimum bond line
The primary function of thermal paste is to fill the microscopic gaps between the CPU and the heatsink, improving thermal conductivity. It helps transfer the heat generated by the CPU quickly and efficiently to the heatsink, thereby lowering the CPU temperature and preventing system instability or damage caused by overheating.
G3380A
1.3 W/m·K
Low minimum bond line

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    LiPOLY® Advance TIMs

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