RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
G3380A
1.3 W/m*K
Low minimum bond line
The primary function of thermal paste is to fill the microscopic gaps between the CPU and the heatsink, improving thermal conductivity. It helps transfer the heat generated by the CPU quickly and efficiently to the heatsink, thereby lowering the CPU temperature and preventing system instability or damage caused by overheating.

CATEGORY

FEATURES

/ Thermal conductivity: 1.3 W/m*K
/ Low thermal impedance
/ Can be applied manually dispensed or screen printed
/ Low minimum bond line

CONFIGURATIONS

/ Tinplate Can: 1kg
/ Other special and custom sizes are available upon request

TYPICAL APPLICATION

/ LED appliance
/ EV electric vehicle
/ CPU and chip coolers
/ Switching power supplies
/ 5G base station & infrastructure
/ Between any heat-generating component and heat sink

TYPICAL PROPERTIES

PROPERTY G3380A UNIT TEST METHOD
Color White - Visual
Resin base Silicone - -
Filler Non-Metal - -
Viscosity 16.5 Pa.s ISO 3219
Density 2.2 g/cm³ ASTM D792
Application temperature -60~180 °C -
Bond line thickness 55 µm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 1.3 W/m*K ASTM D5470
Thermal impedance@50psi 0.05 °C-in²/ W ASTM D5470
Thermal impedance@50psi 32.2 °C-mm²/ W ASTM D5470

Related​ Product

G3380A
1.3 W/m*K
Low minimum bond line

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    熱介面管理專家

    LiPOLY® Advance TIMs

    桃園市八德區永豐路435號

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