Thermal Encapsulants

Thermally Conductive encapsulants combines excellent thermal conductivity with insulation properties, effectively reducing electronic component temperatures and protecting circuits. Its good flowability allows it to easily fill complex structures, achieving uniform heat dissipation and enhancing product reliability and lifespan, making it particularly suitable for encapsulating precision electronic components.

Potting compounds fill gaps around electronic components by pouring and curing a liquid gel, creating a long-lasting protective layer that seals air spaces. This provides multiple benefits, including waterproofing, moisture resistance, shock resistance, electrical insulation, and protection of critical wiring.