RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Liquid series

Thermal liquid gap fillers are high-flow, thermally conductive materials designed to fill gaps between electronic components and heat sinks. Compared to traditional thermal pads, these liquids can fully cover irregular surfaces, ensuring superior heat transfer performance. They are suitable for applications with high thermal demands, such as electric vehicle battery modules, servers, and LED lighting systems.

Thermal Putty
Lightweight thermal putty is a low-density, lightweight thermal material commonly used in lightweight drones and EV (electric vehicle) components. For lightweight drones, reducing weight can directly extend flight endurance, as battery weight accounts for a large proportion; lowering the weight effectively improves the endurance per unit of electrical energy. In electric vehicles, lightweight design also reduces energy consumption and increases battery range.
DTT13-s
13.0 W/m*K
No Vertical Flow
Thermal putty features a softness and hardness level between thermal grease and thermal pads. It offers greater durability than thermal grease and better conformability than thermal pads. Its soft texture makes it easy to apply and fill, providing excellent plasticity to accommodate uneven surfaces and eliminate air gaps. Additionally, thermal putty is nearly non-hardening, so it does not introduce internal stress to equipment after application, and it is easier to handle compared to thermal grease.
S-putty5-s
10.0 W/m*K
No Vertical Flow
Lightweight thermal gel combines high thermal conductivity with lightweight properties. Its low-density characteristic helps reduce production costs and energy consumption while enhancing product performance. The high compressibility and tolerance compensation features allow it to fill gaps around electronic components, ensuring close contact with heat sinks and thus improving heat transfer efficiency. These advantages make it an ideal thermal management material for applications such as electronics and electric vehicles.
DTT10-s
10.0 W/m*K
No Vertical Flow
Thermal gel, compared to thermal grease, features non-flowing and anti-sagging properties, making it easier to clean. It can replace thermal pads and offers characteristics such as low oil bleed and non-flowing behavior. Thermal gel can fill larger gaps and simultaneously encapsulate various irregular components, maintaining stability even at high temperatures. Additionally, it provides higher dielectric breakdown voltage insulation, making it suitable for high-power electronic and electrical components.
SH-putty3
8.0 W/m*K
No Vertical Flow
PK700DM
7.0 W/m*K
Fast Curing in room temperature
Thermal silicone putty is a polymer thermal interface material made with a silicone base and added thermal conductive fillers. It offers both electrical insulation and mechanical protection, efficiently transferring and dissipating heat. Thermal silicone is primarily used for thermal management and heat dissipation in industries such as electronics, electrical engineering, automotive, and lighting. Due to its high thermal conductivity, insulation, softness, and high-temperature resistance, thermal silicone has become an indispensable material for thermal management in modern electronic and electrical products.
S-putty2-s
6.0 W/m*K
No Vertical Flow
After applying thermal paste to the surface of the CPU, it effectively eliminates excess air between the processor and the heatsink, enabling high-performance thermal conductivity. This allows the heat generated by the CPU to be transferred to the heatsink more quickly, thereby improving the overall cooling performance of the computer.
G3380T
6.0 W/m*K
Low minimum bond line
The DTT04-s is a Low-density thermal putty. Its lightweight properties reduce production costs, and minimize material usage and energy consumption. It is commonly used in electronic products and automotive electronic devices. With a thermal conductivity of 4.0 W/m*K, this product offers high deformability, allowing flexible adaptation to various gaps and providing tolerance compensation. It effectively addresses issues such as overflow and drying, improves heat transfer, and is suitable for automated dispensing production.
DTT06-s
6.0 W/m*K
No Vertical Flow
Thermal putty is primarily used to fill gaps between electronic components and heat sinks, enhancing heat dissipation efficiency. It effectively conducts heat, rapidly transferring the heat generated by components to the heat sink, thereby lowering component temperatures and preventing overheating damage. Thermal putty overcomes issues such as overflow and drying out commonly seen with thermal grease, and is an ideal choice for automated dispensing production when used with LiPOLY’s dedicated putty dispensing equipment.
H-putty2
6.0 W/m*K
No Vertical Flow
Thermal paste plays a crucial role in computer cooling. When processors (CPUs) or graphics cards (GPUs) operate continuously, they generate a significant amount of heat. If cooling performance is insufficient, it not only affects the overall performance of the computer but may also lead to system instability or crashes due to overheating.
TT3000
6.0 W/m*K
Nano Thermal Grease
PK605DM
5.0 W/m*K
Fast Curing in room temperature
The primary function of thermal paste is to eliminate microscopic gaps and surface irregularities between components. Since air is a poor thermal conductor, these gaps hinder effective heat transfer. By filling these spaces, thermal paste significantly improves thermal conductivity, helping to efficiently dissipate waste heat generated by components such as the CPU to the heatsink. This prevents overheating, ensures system stability, and extends hardware lifespan.
G3380K
4.5 W/m*K
Low minimum bond line
Non-silicone lightweight thermal gel features a “non-silicone” property that prevents the silicone oil migration issues sometimes found in traditional silicone gels, effectively protecting optical or electronic components sensitive to silicone. Its “low-density” characteristic helps achieve product lightweighting and reduces stress on precision components.
NL-putty10-s
10.0 W/m*K
Low outgassing
Non-silicone thermal gel differs from traditional TIMs in that it contains no silicone oil components. It effectively fills surface irregularities of electronic components while avoiding various silicone oil-related issues. Its advantages-no silicone oil contamination, no pump-out effect, excellent stability, and low thermal resistance-make it especially suitable for optical products, sensitive electronic components, and applications requiring high reliability.
N-putty5-s
9.0 W/m*K
Low outgassing
Silicon-Free Thermal Putty N-putty3-s with thermal conductivity of 7.0 W/m*K features no low-molecular siloxane volatilization, preventing electrical contact failures. It is ideal for optical products and sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and provides tolerance compensation. It overcomes issues like thermal paste overflow and drying out, and can be paired with LiPOLY's specialized putty dispensing machine for ideal automated production.
N-putty3-s
7.0 W/m*K
Low outgassing
Silicone-free lightweight thermal gel contains no silicone oil, completely eliminating the potential risk of silicone oil bleeding, thus protecting silicone-sensitive components and enhancing product reliability and environmental value. Its low-density properties significantly reduce product weight, aligning with the trend of slim and lightweight designs, lowering energy consumption, and reducing stress on small components.
NL-putty06-s
6.0 W/m*K
Low outgassing
G3380NT Non-silicone thermal grease with a thermal conductivity of 6.0 W/m*K, featuring zero low-molecular-weight siloxane volatilization to prevent electrical contact failure. Ideal for optical products and sensitive electronic components, it offers extremely low thermal resistance and excellent thermal conductivity.
G3380NT
6.0 W/m*K
Low outgassing
Non-silicone thermal gel N-putty2-s features a thermal conductivity of 5.0 W/m*K and is free from low-molecular-weight siloxane volatiles, preventing electrical contact failures. It is ideal for optical products or sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and compensates for tolerances. It overcomes issues such as thermal grease overflow and drying. When used with LiPOLY's dedicated putty dispensing machine, it is an ideal choice for automated dispensing production.
N-putty2-s
5.0 W/m*K
Low outgassing
G3380NK是具有熱傳導係數：4.5 W/m*K的非矽型導熱膏，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，具有極低熱阻和良好的導熱性，已廣泛用於消費電子產品和微處理器的熱控制技術，當組件的溫度升高，潤滑脂的粘性會降低，可以潤濕界面元件
G3380NK
4.5 W/m*K
Low outgassing
Non-silicone low-density thermal putty is a specialized material designed for electronic thermal management. Unlike traditional silicone-based thermal materials, it contains no silicone oil, effectively preventing issues such as contact failure or contamination caused by silicone oil migration. This makes it especially suitable for optical or precision electronic components that are sensitive to silicone.
NL-putty04-s
4.0 W/m*K
Low outgassing
Non-silicone thermal putty is a high-performance thermal interface material that does not contain silicone oil or siloxane components. If your application requires avoiding silicone oil volatilization, is sensitive to silicone ingredients, or demands long-term stability, it is recommended to choose non-silicone thermal putty. These products are especially suitable for high-end applications such as optical components, automotive electronics, and servers, and can be customized to meet specific requirements.
N-putty-s
3.5 W/m*K
Low outgassing
G3380NJ is a non-silicone thermal grease with a thermal conductivity of 3.2 W/m*K. It contains no low-molecular-weight siloxane volatilization, preventing electrical contact failures. This makes it suitable for optical products and sensitive electronic components. Featuring extremely low thermal resistance and excellent heat conductivity.
G3380NJ
3.2 W/m*K
Low outgassing
導熱膠是一種結合導熱與黏接功能的材料，廣泛應用於電子元件與散熱結構的介面，能有效傳導熱量並提供機械固定。 NEP230 是非矽型雙劑導熱固定膠，可以在室溫或高溫下固化後具有良好的固定力，與導熱墊片相比，非矽型雙劑導熱固定膠不僅對部件產生低應力、高導熱性、低粘度，同時能保持絕緣性能，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。
NEP230
3.0 W/m*K
Low outgassing
PCB 導熱灌膠 EP770-s 是非矽型灌膠，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用。透過將液態膠體澆灌並固化於電子組件之間，可填滿電子器件周圍空氣空間的縫隙，形成長期且有效的防護層，可達到防水、防潮、耐震、電氣絕緣和保護關鍵線束等多重效果。
EP770-s
2.5 W/m*K
Low outgassing
Lightweight thermal putty is a low-density, lightweight thermal material commonly used in lightweight drones and EV (electric vehicle) components. For lightweight drones, reducing weight can directly extend flight endurance, as battery weight accounts for a large proportion; lowering the weight effectively improves the endurance per unit of electrical energy. In electric vehicles, lightweight design also reduces energy consumption and increases battery range.
DTT13-s
13.0 W/m*K
No Vertical Flow
Thermal putty features a softness and hardness level between thermal grease and thermal pads. It offers greater durability than thermal grease and better conformability than thermal pads. Its soft texture makes it easy to apply and fill, providing excellent plasticity to accommodate uneven surfaces and eliminate air gaps. Additionally, thermal putty is nearly non-hardening, so it does not introduce internal stress to equipment after application, and it is easier to handle compared to thermal grease.
S-putty5-s
10.0 W/m*K
No Vertical Flow
Non-silicone lightweight thermal gel features a “non-silicone” property that prevents the silicone oil migration issues sometimes found in traditional silicone gels, effectively protecting optical or electronic components sensitive to silicone. Its “low-density” characteristic helps achieve product lightweighting and reduces stress on precision components.
NL-putty10-s
10.0 W/m*K
Low outgassing
Lightweight thermal gel combines high thermal conductivity with lightweight properties. Its low-density characteristic helps reduce production costs and energy consumption while enhancing product performance. The high compressibility and tolerance compensation features allow it to fill gaps around electronic components, ensuring close contact with heat sinks and thus improving heat transfer efficiency. These advantages make it an ideal thermal management material for applications such as electronics and electric vehicles.
DTT10-s
10.0 W/m*K
No Vertical Flow
Non-silicone thermal gel differs from traditional TIMs in that it contains no silicone oil components. It effectively fills surface irregularities of electronic components while avoiding various silicone oil-related issues. Its advantages-no silicone oil contamination, no pump-out effect, excellent stability, and low thermal resistance-make it especially suitable for optical products, sensitive electronic components, and applications requiring high reliability.
N-putty5-s
9.0 W/m*K
Low outgassing
Thermal gel, compared to thermal grease, features non-flowing and anti-sagging properties, making it easier to clean. It can replace thermal pads and offers characteristics such as low oil bleed and non-flowing behavior. Thermal gel can fill larger gaps and simultaneously encapsulate various irregular components, maintaining stability even at high temperatures. Additionally, it provides higher dielectric breakdown voltage insulation, making it suitable for high-power electronic and electrical components.
SH-putty3
8.0 W/m*K
No Vertical Flow
Silicon-Free Thermal Putty N-putty3-s with thermal conductivity of 7.0 W/m*K features no low-molecular siloxane volatilization, preventing electrical contact failures. It is ideal for optical products and sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and provides tolerance compensation. It overcomes issues like thermal paste overflow and drying out, and can be paired with LiPOLY's specialized putty dispensing machine for ideal automated production.
N-putty3-s
7.0 W/m*K
Low outgassing
PK700DM
7.0 W/m*K
Fast Curing in room temperature
Thermal silicone putty is a polymer thermal interface material made with a silicone base and added thermal conductive fillers. It offers both electrical insulation and mechanical protection, efficiently transferring and dissipating heat. Thermal silicone is primarily used for thermal management and heat dissipation in industries such as electronics, electrical engineering, automotive, and lighting. Due to its high thermal conductivity, insulation, softness, and high-temperature resistance, thermal silicone has become an indispensable material for thermal management in modern electronic and electrical products.
S-putty2-s
6.0 W/m*K
No Vertical Flow
G3380NT Non-silicone thermal grease with a thermal conductivity of 6.0 W/m*K, featuring zero low-molecular-weight siloxane volatilization to prevent electrical contact failure. Ideal for optical products and sensitive electronic components, it offers extremely low thermal resistance and excellent thermal conductivity.
G3380NT
6.0 W/m*K
Low outgassing
After applying thermal paste to the surface of the CPU, it effectively eliminates excess air between the processor and the heatsink, enabling high-performance thermal conductivity. This allows the heat generated by the CPU to be transferred to the heatsink more quickly, thereby improving the overall cooling performance of the computer.
G3380T
6.0 W/m*K
Low minimum bond line
Silicone-free lightweight thermal gel contains no silicone oil, completely eliminating the potential risk of silicone oil bleeding, thus protecting silicone-sensitive components and enhancing product reliability and environmental value. Its low-density properties significantly reduce product weight, aligning with the trend of slim and lightweight designs, lowering energy consumption, and reducing stress on small components.
NL-putty06-s
6.0 W/m*K
Low outgassing

熱介面管理專家

LiPOLY® Advance TIMs

桃園市八德區永豐路435號

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