NEW
DTT61-s Immersion Cooling Thermal Conductive Pad
Thermal conductivity：
6.0 W/m·K
Thermal pads for single-phase immersion cooling feature optimized chemical formulations tested for durability and high-temp operation. Designed for high-power uses like AI servers and data centers, they improve thermal management and system stability.
Thermal Resistance vs. Pressure vs. Deflection
FEATURES
- Thermal Conductivity：6.0 W/m·K
- Natural tack for easy process application
- Low Thermal Resistance
- Available in a range of thicknesses
CONFIGURATIONS
- Roll form
- Sheets form
- Die-cuts parts
TYPICAL APPLICATION
- 伺服器單相浸沒式散熱
- 電競電腦
- AI 個人電腦
- 固態硬碟 (SSD)
- Heat pipe assemblies
- Memory modules
- 功率放大器
Specifications
| Item | DTT61-s Immersion Cooling Thermal Conductive Pad | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Red | – | Visual |
| Surface tack 2-side/1-side | 2 | – | – |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.3 | g/cm³ | ASTM D792 |
| Application temperature | -60~200 | °C | – |
| Dielectric breakdown | 8 | KV/mm | ASTM D149 |
| Surface resistivity | >10¹¹ | Ohm | ASTM D257 |
| ROHS & REACH | Compliant | – | – |
| THERMAL | |||
| Thermal conductivity | 6.0 | W/m·K | ASTM D5470 |
| Thermal impedance@10 psi | 0.387 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@20 psi | 0.375 | °C-in²/ W | ASTM D5470 |