TPS5868
3.0 W/m*K
Sealing Glue
Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
TPS589
0.8 W/m*K
Sealing Glue
Encapsulation resin refers to a polymer material used to cover, protect, and secure electronic components during the assembly of electronic products. This encapsulating material plays a crucial role in enhancing the reliability, durability, and protective performance of electronic devices.
CATEGORY
Sealing Glue
FEATURES
/ Thermal conductivity: 0.8 W/m*K
/ Two-parts package and easy to use
/ Waterproof and air-tight
/ Thermally conductive vibration dampening
SPECIFICATIONS
/ TPS589 The principle of moisture hardening is to harden by reacting with moisture in the air at room temperature. The hardening process starts from the surface in contact with the air and hardens in the deep direction, so the hardening process is a little slow. The speed of hardening is related to temperature and humidity. When there is not enough water vapor in the use environment to react, it may not be completely hardened.
TYPICAL APPLICATION
/ Automotive electronics
/ Telecommunications
/ Computer and peripherals
/ Between any heat-generating component and a heat sink
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | TPS589 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | White | - | Visual |
| Resin base | Silicone | - | - |
| A:B | 100:3 | - | - |
| Viscosity | 5.0 | Pa.s | ISO 3219 |
| Density | 1.8 | g/cm³ | ASTM D792 |
| Application temperature | -60~180 | °C | - |
| Hardness | 50 | Shore A | ASTM D2240 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 0.8 | W/m*K | ASTM D5470 |
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