液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
電子封膠(Encapsulation Resin)是指在電子產品組裝過程中,用於覆蓋、保護和固定電子元件的聚合物材料。這種封裝材料在提高電子產品的可靠性、耐用性以及防護性能方面起著至關重要的作用。
TPS589 是可以在室溫或高溫下固化雙劑導熱灌封膠,灌封膠是液體流動性導熱膠,可填滿電子器件周圍空氣空間的縫隙,固化後與發熱的電子元件和散熱器保持密切接觸,使電子產品能夠在高功率下運行進行熱傳導,熱傳導係數:0.8 W/m*K的間隙填充材料。/ Thermal conductivity: 0.8 W/m*K
/ Two-parts package and easy to use
/ Waterproof and air-tight
/ Thermally conductive vibration dampening
/ TPS589 The principle of moisture hardening is to harden by reacting with moisture in the air at room temperature. The hardening process starts from the surface in contact with the air and hardens in the deep direction, so the hardening process is a little slow. The speed of hardening is related to temperature and humidity. When there is not enough water vapor in the use environment to react, it may not be completely hardened.
/ Automotive electronics
/ Telecommunications
/ Computer and peripherals
/ Between any heat-generating component and a heat sink
/ 5G base station & infrastructure
/ EV electric vehicle
PROPERTY | TPS589 | TEST METHOD | UNIT |
---|---|---|---|
Color | White | Visual | - |
Resin base | Silicone | - | - |
A:B | 100:3 | - | - |
Viscosity | 5.0 | ISO 3219 | Pa.s |
Density | 1.8 | ASTM D792 | g/cm³ |
Application temperature | -60~180 | - | °C |
Hardness | 50 | ASTM D2240 | Shore A |
ROHS & REACH | Compliant | - | - |
THERMAL | |||
Thermal conductivity | 0.8 | ASTM D5470 | W/m*K |
LiPOLY
旭立具備深厚技術與豐富應用經驗,匯聚各領域頂尖人才,專注開發高性能導熱及創新材料。配備先進實驗室與自動化生產設備,進行高精度測試與生產,確保產品穩定可靠。
Professional quality
擁有完整的品質管理制度,並取得全球性認證
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Manufacture
無塵室、自動化設備以及多樣化的成型技術