Thermally conductive potting compound (also known as thermally conductive encapsulant) is a liquid slurry with excellent flowability and thermal conductivity. It can cover and fill gaps between electronic components and modules, aiming to enhance heat dissipation and provide electrical insulation to protect components from environmental damage. After curing at room temperature, thermally conductive potting compound offers dustproof, moisture-proof, shockproof, insulation, and thermal conduction functions. It is widely used in LED modules, power modules, and automotive electronics.