Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
TPS5868
3.0 W/m·K
Encapsulants
Thermally conductive potting compound (also known as thermally conductive encapsulant) is a liquid slurry with excellent flowability and thermal conductivity. It can cover and fill gaps between electronic components and modules, aiming to enhance heat dissipation and provide electrical insulation to protect components from environmental damage. After curing at room temperature, thermally conductive potting compound offers dustproof, moisture-proof, shockproof, insulation, and thermal conduction functions. It is widely used in LED modules, power modules, and automotive electronics.
CATEGORY
Encapsulants
FEATURES
/ Thermal conductivity: 3.0 W/m·K
/ Two-parts package and easy to use
/ Waterproof and air-tight
/ Thermally conductive vibration dampening
CONFIGURATIONS
/TPS5868 If the interface has organic compounds such as Nitrogen, Phosphorous, Sulfur etc., and heavy metals ionic compound such as Tin, Lead, Mercury, Antimony, Bismuth, Arsenic etc., and Organometallic-salts etc., which will cause the gel incomplete curving even will be non-curved.
TYPICAL APPLICATION
/ Automotive electronics
/ Telecommunication hardware
/ Computer and peripherals
/ 5G base station & infrastructure
/ Between a component and heat sink
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | TPS5868 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | White-A Gray-B | - | Visual |
| Resin Base | Silicone | - | - |
| A:B | 100:100 | - | - |
| Viscosity | 8.0 | Pa.s | ISO 3219 |
| Density | 2.8 | g/cm³ | ASTM D792 |
| Application temperature | -60~180 | °C | - |
| Hardness | 5 | Shore A | ASTM D2240 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 3.0 | W/m·K | ASTM D5470 |
| Dielectric breakdown | 14 | KV/mm | ASTM D149 |
| Volume resistivity | >10¹² | Ohm-m | ASTM D257 |
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