RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
NT94-s
4.0 W/m*K
Absorber
Low outgassing
Thermal EMI Shielding Pad NT94-s is made of non-silicone resin materials with no low molecular siloxane volatilization, featuring a composite pad that combines thermal conductivity and electromagnetic wave absorption functions. This gap filler material has a thermal conductivity of 4.0 W/m*K, operates in the frequency range of 10MHz-77GHz, and offers flexibility and compressibility with customizable die-cutting and stamping capabilities. SunRise's professional R&D expertise enables us to immediately provide cutting-edge thermal management solutions to meet customers' specialized requirements for today's advanced products.

CATEGORY

FEATURES

/ Thermal conductivity: 4.0 W/m*K
/ Excellent absorption characteristics
/ Naturally tacky
/ Reworkable

SPECIFICATIONS

/ Sheet form
/ Die-cut parts

TYPICAL APPLICATION

/ IC, CPU, MOS, LED, M/B, Heat sink
/ LCD-TV, Notebook PC, PC, Telecom device, Wireless hub
/ DDR II module, DVD applications, Hand-set applications
/ 5G base station & infrastructure
/ EV electric vehicle

// 2.4 GHz Wi-Fi Router , Bluetooth
// 3.5 GHz 5G Mobile Networks
// 5.0 GHz Wi-Fi Router
// 6.0 GHz Wi-Fi Router
// 12~18 GHz Low Earth Orbit (LEO) System
// 28 GHz 5G Mobile Networks
// 39 GHz 5G Mobile Networks

TYPICAL PROPERTIES

PROPERTY NT94-s UNIT TEST METHOD
Color Dark Gray - Visual
Surface tack 2-side/1-side 2 - -
Thickness Customized mm ASTM D374
Density 3.6 g/cm³ ASTM D792
Hardness 65 Shore OO ASTM D2240
Application temperature -60~125 °C -
Surface resistivity >10¹² Ohm ASTM D257
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 4.0 W/m*K ASTM D5470
Thermal impedance@10 psi 0.463 °C-in²/ W ASTM D5470
Thermal impedance@50 psi 0.128 °C-in²/ W ASTM D5470

Related​ Product

NT94-s
4.0 W/m*K
Absorber
Low outgassing

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