RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Silicone・TIMs

Silicon-based thermal interface materials feature ultra-high thermal conductivity, providing effective heat dissipation enhancement and enabling equipment to maintain high-performance operation for extended periods. They typically use silicone oil or silicone elastomers as the base material, mixed with metal oxides or other high thermal conductivity fillers. Thermal pads are suitable for gap-filling thermal conduction applications with multiple heat sources, commonly used in automotive electronics, 5G base stations, and aerospace fields.

H-putty
3.5 W/m·K
No Vertical Flow
S-putty
3.5 W/m·K
No Vertical Flow
G3380B
3.2 W/m·K
Low minimum bond line
S818
3.2 W/m·K
Tensile strength 0.44 MPa
TEM96B
3.0 W/m·K
Absorber
DTT44-s
3.0 W/m·K
Lightweight
BS75K-s
3.0 W/m·K
Shore OO/18
DTT44-s
3.0 W/m·K
Absorber
BS87-s
3.0 W/m·K
Shore OO/10
TPS5868
3.0 W/m·K
Sealing Glue
SH3000
3.0 W/m·K
Fiberglass reinforced
S282-s
2.5 W/m·K
Shore OO/18
S282-s
2.5 W/m·K
Shore OO/18
S393
2.2 W/m·K
Tensile strength 0.75 MPa
S818
3.2 W/m·K
Tensile strength 0.44 MPa
SH-putty3
8.0 W/m·K
No Vertical Flow
SH1500
1.5 W/m·K
Fiberglass reinforced
SH2000
2.0 W/m·K
Fiberglass reinforced
SH3000
3.0 W/m·K
Fiberglass reinforced
SP-23
0.8 W/m·K
TO220 / TO3P
ST6000-S
1.8 W/m·K
High Temperature
ST6000F
1.2 W/m·K
High Temperature
T-top81-s
8.0 W/m·K
Extreme Series
T-top91-s
13.0 W/m·K
Extreme Series

For all informaton you need

CALL US: 03-3788588

Thermal Solutions Expert

LiPOLY® Advance TIMs

Taoyuan City, Bade District, Yongfeng Road, No. 435

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