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IECQ 080000

Liquid series

Thermal liquid gap fillers are high-flow, thermally conductive materials designed to fill gaps between electronic components and heat sinks. Compared to traditional thermal pads, these liquids can fully cover irregular surfaces, ensuring superior heat transfer performance. They are suitable for applications with high thermal demands, such as electric vehicle battery modules, servers, and LED lighting systems.

Thermal Putty
The primary function of thermal paste is to fill the microscopic gaps between the CPU and the heatsink, improving thermal conductivity. It helps transfer the heat generated by the CPU quickly and efficiently to the heatsink, thereby lowering the CPU temperature and preventing system instability or damage caused by overheating.
G3380A
1.3 W/m·K
Low minimum bond line
Encapsulation resin refers to a polymer material used to cover, protect, and secure electronic components during the assembly of electronic products. This encapsulating material plays a crucial role in enhancing the reliability, durability, and protective performance of electronic devices.
TPS589
0.8 W/m·K
Sealing Glue
電子灌膠 TPS31是一款低密度電子灌封材料。透過將膠體澆灌並固化於電子組件之間，形成長期且有效的防水、電氣絕緣和保護等多重效果。用於普通灌封、電源模塊灌封、各類傳感氣灌封等。
TPS31
0.55 W/m·K
Sealing Glue
Silicone thermal putty is a thermal interface material made from a silicone base combined with thermally conductive powders, blended using specialized equipment. It offers excellent thermal conductivity, insulation, and high-temperature resistance. Widely used in electronics, automotive, and LED industries, it enhances heat dissipation efficiency and extends product lifespan by effectively transferring heat from heat-generating components to heat sinks.
H-putty
3.5 W/m·K
No Vertical Flow
Non-silicone thermal putty is a high-performance thermal interface material that does not contain silicone oil or siloxane components. If your application requires avoiding silicone oil volatilization, is sensitive to silicone ingredients, or demands long-term stability, it is recommended to choose non-silicone thermal putty. These products are especially suitable for high-end applications such as optical components, automotive electronics, and servers, and can be customized to meet specific requirements.
N-putty-s
3.5 W/m·K
Low outgassing
G3380NJ is a non-silicone thermal grease with a thermal conductivity of 3.2 W/m*K. It contains no low-molecular-weight siloxane volatilization, preventing electrical contact failures. This makes it suitable for optical products and sensitive electronic components. Featuring extremely low thermal resistance and excellent heat conductivity.
G3380NJ
3.2 W/m·K
Low outgassing
The G3380B series thermal Paste features extremely low thermal resistance and excellent thermal conductivity. It has been widely used in thermal management for consumer electronics and microprocessors. As the temperature of components rises, the viscosity of the grease decreases, allowing it to better wet the interface components. With a thermal conductivity of 3.2 W/m*K, it serves as an effective gap-filling material.
G3380B
3.2 W/m·K
Low minimum bond line
導熱膠是一種結合導熱與黏接功能的材料，廣泛應用於電子元件與散熱結構的介面，能有效傳導熱量並提供機械固定。 NEP230 是非矽型雙劑導熱固定膠，可以在室溫或高溫下固化後具有良好的固定力，與導熱墊片相比，非矽型雙劑導熱固定膠不僅對部件產生低應力、高導熱性、低粘度，同時能保持絕緣性能，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。
NEP230
3.0 W/m·K
Low outgassing
Thermally conductive potting compound (also known as thermally conductive encapsulant) is a liquid slurry with excellent flowability and thermal conductivity. It can cover and fill gaps between electronic components and modules, aiming to enhance heat dissipation and provide electrical insulation to protect components from environmental damage. After curing at room temperature, thermally conductive potting compound offers dustproof, moisture-proof, shockproof, insulation, and thermal conduction functions. It is widely used in LED modules, power modules, and automotive electronics.
TPS5868
3.0 W/m·K
Sealing Glue
PCB 導熱灌膠 EP770-s 是非矽型灌膠，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用。透過將液態膠體澆灌並固化於電子組件之間，可填滿電子器件周圍空氣空間的縫隙，形成長期且有效的防護層，可達到防水、防潮、耐震、電氣絕緣和保護關鍵線束等多重效果。
EP770-s
2.5 W/m·K
Low outgassing
PK223DM
2.2 W/m·K
Fast Curing in room temperature
散熱膠，又稱為導熱膠，是具有良好熱傳導能力的黏合劑，常用於電子元件與散熱片之間的接合。能有效填補元件間的空隙，確保熱能高效傳遞。與散熱膏不同，散熱膠具有黏性，能將兩個表面黏合在一起，提供機械固定，無需額外的緊固件。 NEP220 是非矽型雙劑導熱固定膠，可以在室溫或高溫下固化後具有良好的固定力，與導熱墊片相比，非矽型雙劑導熱固定膠不僅對部件產生低應力、高導熱性、低粘度，同時能保持絕緣性能，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。
NEP220
2.2 W/m·K
Low outgassing
D2000 is a two-part Curing thermal grease that cures at room or high temperatures, differing from traditional thermal pastes by its adhesive properties. It can be used with thermal grease dispensing services to secure heat-generating components to heat sinks. The cured thermal grease offers extremely low thermal resistance and high reliability, eliminating issues like drying out or overflowing.
D2000
2.0 W/m·K
Never Pump-out and Dry
TIM12
2.0 W/m·K
No freeze preservation required
電源保護灌封膠 TPS32 是一款輕量化的灌封膠。可為產品提高其性能及減少能源消耗，常被應用在航空航太及汽車電子設備上。導熱係數1.50 W/m*K，，可填滿電子裝置周圍空氣空間的縫隙，固化後與發熱的電子元件和散熱器保持密切接觸，使電子產品能夠在高功率下運作進行熱傳導。能顯著提升產品的可靠度、使用壽命，並降低外界環境帶來的損害風險。
TPS32
1.5 W/m·K
Sealing Glue

Expert Thermal Solutions

LiPOLY® Advance TIMs

Taoyuan City, Bade District, Yongfeng Road, No. 435

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