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AI GPU module

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Power density inside AI GPU modules keeps climbing, pushing the GPU, HBM, and VRM ever closer to their thermal design limits. This article focuses on GPU chip-level TIM, examining how PCM900 phase change material works and the reliability data behind it.

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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.