RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

矽型 · 導熱材料

矽型導熱材料具有超高的熱傳導係數,提供有效提高散熱效果,能夠使設備長時間維持高效能運行。多採用矽油或矽彈性體為基底,再混入金屬氧化物或其他高導熱填料。導熱墊片適合多發熱源填補間隙導熱使用,常應用於汽車電子、5G 基地台與航太等領域。

PK700
7.0 W/m*K
General Thermal
DTT06-s
6.0 W/m*K
No Vertical Flow
TT3000
6.0 W/m*K
Nano Thermal Grease
H-putty2
6.0 W/m*K
No Vertical Flow
S-putty2-s
6.0 W/m*K
No Vertical Flow
G3380T
6.0 W/m*K
Low minimum bond line
PK605
6.0 W/m*K
General Thermal
BS89-s
5.0 W/m*K
Shore OO/25
TEM96D
5.0 W/m*K
EMI Absorber
DTT65-s
5.0 W/m*K
5G mmWave
PK605DM
5.0 W/m*K
Fast Curing in room temperature
PK504
5.0 W/m*K
General Thermal
DTT44-s
3.0 W/m*K
5G mmWave
DTT65-s
5.0 W/m*K
5G mmWave
G3380A
1.3 W/m*K
Low minimum bond line
G3380B
3.2 W/m*K
Low minimum bond line
G3380K
4.5 W/m*K
Low minimum bond line
G3380T
6.0 W/m*K
Low minimum bond line
H-putty
3.5 W/m*K
No Vertical Flow
H-putty2
6.0 W/m*K
No Vertical Flow
HC-93
2.5 W/m*K
TO220 / TO3P
PK223
2.0 W/m*K
General Thermal
PK223DM
2.2 W/m*K
Fast Curing in room temperature
PK404
4.0 W/m*K
General Thermal

For all informaton you need

CALL US: 03-3788588

熱介面管理專家

旭立科技股份有限公司

桃園市八德區永豐路435號

CONTACT