RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

2-Part

Dual-component thermal conductive liquid materials are two-part systems requiring mixing before application. After curing, they provide excellent thermal conductivity, effectively transferring heat away from components.

These materials are commonly used to fill gaps between electronic components, improving heat dissipation and reducing operating temperatures.

PK700DM
7.0 W/m·K
Fast Curing in room temperature
DTT56-s
6.0 W/m·K
Stable thermal performance at elevated temperatures.
PK605DM
5.0 W/m·K
Fast Curing in room temperature
DTT55-s
5.0 W/m·K
Stable thermal performance at elevated temperatures.
DTT54-s
4.0 W/m·K
Stable thermal performance at elevated temperatures.
PK404DM-H
3.6 W/m·K
Fast Curing in room temperature
TPS5868
3.0 W/m·K
Encapsulants
PK223DM
2.2 W/m·K
Fast Curing in room temperature
TPS586
1.5 W/m·K
Encapsulants
TPS589
0.8 W/m·K
Encapsulants
PK700DM
7.0 W/m·K
Fast Curing in room temperature
DTT56-s
6.0 W/m·K
Stable thermal performance at elevated temperatures.
PK605DM
5.0 W/m·K
Fast Curing in room temperature
DTT55-s
5.0 W/m·K
Stable thermal performance at elevated temperatures.
DTT54-s
4.0 W/m·K
Stable thermal performance at elevated temperatures.
PK404DM-H
3.6 W/m·K
Fast Curing in room temperature
TPS5868
3.0 W/m·K
Encapsulants
PK223DM
2.2 W/m·K
Fast Curing in room temperature
TPS586
1.5 W/m·K
Encapsulants
TPS589
0.8 W/m·K
Encapsulants

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LiPOLY® Advance TIMs

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