RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

2-Part

Dual-component thermal conductive liquid materials are two-part systems requiring mixing before application. After curing, they provide excellent thermal conductivity, effectively transferring heat away from components.

These materials are commonly used to fill gaps between electronic components, improving heat dissipation and reducing operating temperatures.

PK700DM
7.0 W/m*K
Fast Curing in room temperature
PK605DM
5.0 W/m*K
Fast Curing in room temperature
TIM14
4.0 W/m*K
No freeze preservation required
PK404DM
3.6 W/m*K
Fast Curing in room temperature
TPS5868
3.0 W/m*K
Sealing Glue
PK223DM
2.2 W/m*K
Fast Curing in room temperature
TIM12
2.0 W/m*K
No freeze preservation required
D2000
2.0 W/m*K
Never Pump-out and Dry
TPS586
1.5 W/m*K
Sealing Glue
TPS32
1.5 W/m*K
Sealing Glue
TPS589
0.8 W/m*K
Sealing Glue
TPS31
0.55 W/m*K
Sealing Glue
PK700DM
7.0 W/m*K
Fast Curing in room temperature
PK605DM
5.0 W/m*K
Fast Curing in room temperature
TIM14
4.0 W/m*K
No freeze preservation required
PK404DM
3.6 W/m*K
Fast Curing in room temperature
TPS5868
3.0 W/m*K
Sealing Glue
PK223DM
2.2 W/m*K
Fast Curing in room temperature
TIM12
2.0 W/m*K
No freeze preservation required
D2000
2.0 W/m*K
Never Pump-out and Dry
TPS586
1.5 W/m*K
Sealing Glue
TPS32
1.5 W/m*K
Sealing Glue
TPS589
0.8 W/m*K
Sealing Glue
TPS31
0.55 W/m*K
Sealing Glue

熱介面管理專家

LiPOLY® Advance TIMs

桃園市八德區永豐路435號

CONTACT