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    • 馬達灌封膠TPS586外包裝

      Liquid series

      High-Flow gap fillers fully cover irregular surfaces, unlike thermal pads.

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      Including high ductile, ultra-thin, ultra-soft, and low-bleed Thermal pads.

      EMI Shielding Pad

      Thermal conductive & RF absorption, enhancing product reliability.

      Tape series

      Reduces heatsink bonding steps while solving fixation and thermal issues.

      Lightweight series

      Reduce device weight while offering high thermal conductivity.

      Electrical insulator

      Ideal for applications needing both thermal and electrical solutions.

      Graphite Sheets

      Ultra-thin, flexible, perfect for space-saving & high-performance devices.

      Thermal Break

      Lightweight composite withstands 1300°C to prevent thermal runaway.

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      In line with technological development trends and the global environmental protection movement, we continuously deliver outstanding R&D outputs in product and process development.

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      Holds multiple global patents for thermal conductive materials.

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      About Us

      LiPOLY® TIMs Technology possesses profound technical expertise and extensive application experience, with top-tier talent from diverse fields dedicated to developing high-performance thermal management and innovative materials. Equipped with state-of-the-art laboratory facilities and automated manufacturing equipment, we conduct high-precision testing and analysis to ensure product stability and reliability.

      Learn more

      Professional Quality

      We maintain a comprehensive quality management system and have obtained international certifications.

      Company History

      In June 2002, we developed and manufactured the first batch of K0.8 to K3 thermally conductive materials.

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      Holds multiple global patents for thermal conductive materials.

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logo main
  • Index
  • Products
    • 馬達灌封膠TPS586外包裝

      Liquid series

      High-Flow gap fillers fully cover irregular surfaces, unlike thermal pads.

      Thermal Pad

      Including high ductile, ultra-thin, ultra-soft, and low-bleed Thermal pads.

      EMI Shielding Pad

      Thermal conductive & RF absorption, enhancing product reliability.

      Tape series

      Reduces heatsink bonding steps while solving fixation and thermal issues.

      Lightweight series

      Reduce device weight while offering high thermal conductivity.

      Electrical insulator

      Ideal for applications needing both thermal and electrical solutions.

      Graphite Sheets

      Ultra-thin, flexible, perfect for space-saving & high-performance devices.

      Thermal Break

      Lightweight composite withstands 1300°C to prevent thermal runaway.

  • Development

    • Technologies

      Development

      In line with technological development trends and the global environmental protection movement, we continuously deliver outstanding R&D outputs in product and process development.

      Learn more

      Material Analysis

      Control of hazardous substances in accordance with customer and environmental requirements.

      Reliability Laboratory

      Effectively control and prevent all potential quality issues that may occur.

      Manufacture

      Cleanrooms, automated equipment, and diverse molding technologies.

      Patents

      Holds multiple global patents for thermal conductive materials.

  • About Us

    • Company

      About Us

      LiPOLY® TIMs Technology possesses profound technical expertise and extensive application experience, with top-tier talent from diverse fields dedicated to developing high-performance thermal management and innovative materials. Equipped with state-of-the-art laboratory facilities and automated manufacturing equipment, we conduct high-precision testing and analysis to ensure product stability and reliability.

      Learn more

      Professional Quality

      We maintain a comprehensive quality management system and have obtained international certifications.

      Company History

      In June 2002, we developed and manufactured the first batch of K0.8 to K3 thermally conductive materials.

      Responsible Business Alliance

      RBA Code of Conduct

      Patents

      Holds multiple global patents for thermal conductive materials.

  • News
    • Exhibition
    • Technical
    • Newest
  • Contact Us
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Low outgassing thermal interface materials for thermal management and reliability in LEO satellite and aerospace applications

Low-Outgassing Thermal Interface Materials for LEO Satellite Thermal Management

Technical
2026-04-24

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LiPOLY® TIMs Technology

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SHIU LI TECHNOLOGY CO.,LTD

  • No. 435 , Bade Dist., Taoyuan City 334, Taiwan (R.O.C.)
  • Email: [email protected]
  • Email: [email protected]
  • TEL: 03-3788588
  • FAX: 03-3788288
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Copyright © 2026 LiPOLY® TIMs, all rights reserved

Thermal Solutions Expert

SHIU LI TECHNOLOGY CO.,LTD

Taoyuan City, Bade District, Yongfeng Road, No. 435

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[email protected]
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N800C Non-Silicone Thermal Pad – Compliant with ASTM E595 Low Outgassing Standards

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