TIM12
2.0 W/m*K
No freeze preservation required
液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
TIM14
4.0 W/m*K
No freeze preservation required
TIM1 導熱固晶膠主要應用於積體電路封裝，用於芯片與均熱片之間的連接，以提高散熱效率，確保電子元件的穩定運行。 它適合自動化點膠作業生產。TIM14 是可以在高溫下固化的雙劑型導熱接著固晶膠不僅對部件產生低應力、低熱阻、良好的黏著力，同時能保持絕緣性能，熱傳導係數 4.0W/m*K 的TIM 1間隙導熱填充材料，適合自動化點膠作業生產 。
CATEGORY
Thermal Putty
FEATURES
/ Excellent thermal conductivity 4.0 W/m*K
/ No freeze preservation required
/ Dispensable for serial manufacture
/ Adhesive for IC packaging design
CONFIGURATIONS
/ Cartridges: 50ml
TYPICAL APPLICATION
/ Designed to provide efficient thermal transfer for the cooling of chip packaging as TIM-1.
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | TIM14 | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Gray-A White-B | Visual | - |
| Resin base | Silicone | - | - |
| Form | Grease | Visual | - |
| Viscosity A/B | 380 | ISO 3219 | Pa.s |
| Working time | 25°C / 24hr | By LiPOLY | - |
| BLT | 27 | - | µm |
| Elongation | 110 | ASTM D412 | % |
| Adhesive strength | 3.5 | - | kgf/cm² |
| THERMAL | |||
| Thermal conductivity | 4.0 | ASTM D5470 | W/m*K |
| Dielectric breakdown | 25 | ASTM D149 | KV/mm |
| Surface resistivity | >10¹³ | ASTM D257 | Ohm |
Related Product
TIM14
4.0 W/m*K
No freeze preservation required