TIM12
2.0 W/m*K
No freeze preservation required
Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
TIM14
4.0 W/m*K
No freeze preservation required
TIM1 thermal die attach adhesives are primarily used in integrated circuit packaging to connect chips and heat spreaders, enhancing heat dissipation efficiency and ensuring stable operation of electronic components. They are suitable for automated dot dispensing in production.
TIM14 is low stress and thermal resistance on components while maintaining good adhesion and insulation properties. It is suitable for automated dot dispensing in production.
CATEGORY
Thermal Putty
FEATURES
/ Excellent thermal conductivity 4.0 W/m*K
/ No freeze preservation required
/ Dispensable for serial manufacture
/ Adhesive for IC packaging design
CONFIGURATIONS
/ Cartridges: 50ml
TYPICAL APPLICATION
/ Designed to provide efficient thermal transfer for the cooling of chip packaging as TIM-1.
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | TIM14 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray-A White-B | - | Visual |
| Resin base | Silicone | - | - |
| Form | Grease | - | Visual |
| Viscosity A/B | 380 | Pa.s | ISO 3219 |
| Working time | 25°C / 24hr | - | By LiPOLY |
| BLT | 27 | µm | - |
| Elongation | 110 | % | ASTM D412 |
| Adhesive strength | 3.5 | kgf/cm² | - |
| THERMAL | |||
| Thermal conductivity | 4.0 | W/m*K | ASTM D5470 |
| Dielectric breakdown | 25 | KV/mm | ASTM D149 |
| Surface resistivity | >10¹³ | Ohm | ASTM D257 |
Related Product
TIM14
4.0 W/m*K
No freeze preservation required