TIM14
4.0 W/m*K
No freeze preservation required
液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
TIM12
2.0 W/m*K
No freeze preservation required
TIM1 導熱晶片接著劑是一種熱固型導熱膏，用於積體電路封裝中芯片和均熱片之間的熱傳導。它是一種膏狀材料，在高溫下固化，具有低熱阻和良好的黏著力，能有效填充介面空隙，提升熱傳導效率。
TIM12 是可以在高溫下固化的雙劑型導熱接著固晶膠不僅對部件產生低應力、低熱阻、良好的黏著力，同時能保持絕緣性能，熱傳導係數2.0 W/m*K的TIM 1間隙導熱填充材料，適合自動化點膠作業生產 。
CATEGORY
Thermal Putty
FEATURES
/ Excellent thermal conductivity 2.0 W/m*K
/ No freeze preservation required.
/ Dispensable for serial manufacture
/ Adhesive for IC packaging design
CONFIGURATIONS
/ Cartridges: 50ml
TYPICAL APPLICATION
/ Designed to provide efficient thermal transfer for the cooling of chip packaging as TIM-1.
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | TIM12 | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Gray-A White-B | Visual | - |
| Resin base | Silicone | - | - |
| Form | Grease | Visual | - |
| Viscosity A/B | 190/150 | ISO 3219 | Pa.s |
| Working time | 25°C / 24hr | By LiPOLY | - |
| BLT | 27 | - | µm |
| Elongation | 170 | ASTM D412 | % |
| Adhesive strength | 0.64 | - | - |
| THERMAL | |||
| Thermal conductivity | 2.0 | ASTM D5470 | W/m*K |
| Dielectric breakdown | 25 | ASTM D149 | KV/mm |
| Surface resistivity | >10¹³ | ASTM D257 | Ohm |
Related Product
TIM12
2.0 W/m*K
No freeze preservation required