TIM14
4.0 W/m*K
No freeze preservation required
Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
TIM12
2.0 W/m*K
No freeze preservation required
TIM1 thermal die attach adhesives are used for thermal conduction between IC chips and heat spreaders in integrated circuit packaging. They are paste-like materials that cure at high temperatures, featuring low thermal resistance and excellent adhesion. These adhesives effectively fill interface gaps, enhancing thermal conduction efficiency.
TIM12 is low stress and low thermal resistance on components while maintaining good adhesion and insulation properties. It is suitable for automated dot dispensing in production.
CATEGORY
Thermal Putty
FEATURES
/ Excellent thermal conductivity 2.0 W/m*K
/ No freeze preservation required.
/ Dispensable for serial manufacture
/ Adhesive for IC packaging design
CONFIGURATIONS
/ Cartridges: 50ml
TYPICAL APPLICATION
/ Designed to provide efficient thermal transfer for the cooling of chip packaging as TIM-1.
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | TIM12 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray-A White-B | - | Visual |
| Resin base | Silicone | - | - |
| Form | Grease | - | Visual |
| Viscosity A/B | 190/150 | Pa.s | ISO 3219 |
| Working time | 25°C / 24hr | - | By LiPOLY |
| BLT | 27 | µm | - |
| Elongation | 170 | % | ASTM D412 |
| Adhesive strength | 0.64 | - | - |
| THERMAL | |||
| Thermal conductivity | 2.0 | W/m*K | ASTM D5470 |
| Dielectric breakdown | 25 | KV/mm | ASTM D149 |
| Surface resistivity | >10¹³ | Ohm | ASTM D257 |
Related Product
TIM12
2.0 W/m*K
No freeze preservation required