液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
D2000
2.0 W/m*K
Never Pump-out and Dry
D2000導熱膠是可以在室溫或高溫下固化的雙液導熱膏，不同於傳統的散熱膏，它具有黏著性，可以搭配導熱膏點膠服務，透過自動塗膠設備將發熱元件固定在散熱器上。固化導熱膏兼具極低熱阻及高可靠度，不會有乾凅、溢流問題。
CATEGORY
Thermal Putty
FEATURES
/ Thermal conductivity:2.0 W/m*K
/ Cured and Re-workable thermal Grease.
/ Without Pump-out and Dry out concern.
/ Great reliability
/ Low thermal resistance and thinner Bond Line Thickness.
CONFIGURATIONS
/ Cartridges: 50ml, 400ml
/ Other special and custom sizes are available upon request
TYPICAL APPLICATION
/ Between CPU and heat sink
/ Between a component and heat sink
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ Mobile devices
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | D2000 | TEST METHOD | UNIT |
|---|---|---|---|
| Color | White-A Gray-B | Visual | - |
| Solid content | Two-part : 100:100 | - | - |
| Viscosity A | 95 | ISO 3219 | Pa.s |
| Viscosity B | 95 | ISO 3219 | Pa.s |
| Density | 2.8 | ASTM D792 | g/cm³ |
| Shelf life | 24 months | - | - |
| Hardness (AFTER CURE) | 75 | ASTM D2240 | Shore OO |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 2.0 | ASTM D5470 | W/m*K |
| Thermal impedance@2mils BLT | 0.042 | ASTM D5470 | °C-in²/ W |
Related Product
D2000
2.0 W/m*K
Never Pump-out and Dry