RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
D2000
2.0 W/m*K
Never Pump-out and Dry
D2000 is a two-part Curing thermal grease that cures at room or high temperatures, differing from traditional thermal pastes by its adhesive properties. It can be used with thermal grease dispensing services to secure heat-generating components to heat sinks. The cured thermal grease offers extremely low thermal resistance and high reliability, eliminating issues like drying out or overflowing.

CATEGORY

Thermal Putty

FEATURES

/ Thermal conductivity:2.0 W/m*K
/ Cured and Re-workable thermal Grease.
/ Without Pump-out and Dry out concern.
/ Great reliability
/ Low thermal resistance and thinner Bond Line Thickness.

CONFIGURATIONS

/ Cartridges: 50ml, 400ml
/ Other special and custom sizes are available upon request

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ Mobile devices
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY D2000 UNIT TEST METHOD
Color White-A Gray-B - Visual
Solid content Two-part : 100:100 - -
Viscosity A 95 Pa.s ISO 3219
Viscosity B 95 Pa.s ISO 3219
Density 2.8 g/cm³ ASTM D792
Shelf life 24 months - -
Hardness (AFTER CURE) 75 Shore OO ASTM D2240
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 2.0 W/m*K ASTM D5470
Thermal impedance@2mils BLT 0.042 °C-in²/ W ASTM D5470

Related​ Product

D2000
2.0 W/m*K
Never Pump-out and Dry

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