RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
Silicone-free lightweight thermal gel contains no silicone oil, completely eliminating the potential risk of silicone oil bleeding, thus protecting silicone-sensitive components and enhancing product reliability and environmental value. Its low-density properties significantly reduce product weight, aligning with the trend of slim and lightweight designs, lowering energy consumption, and reducing stress on small components.
Silicone-free lightweight thermal gel contains no silicone oil, completely eliminating the potential risk of silicone oil bleeding, thus protecting silicone-sensitive components and enhancing product reliability and environmental value. Its low-density properties significantly reduce product weight, aligning with the trend of slim and lightweight designs, lowering energy consumption, and reducing stress on small components.
Silicone-free lightweight thermal gel contains no silicone oil, completely eliminating the potential risk of silicone oil bleeding, thus protecting silicone-sensitive components and enhancing product reliability and environmental value. Its low-density properties significantly reduce product weight, aligning with the trend of slim and lightweight designs, lowering energy consumption, and reducing stress on small components.
Silicone-free lightweight thermal gel contains no silicone oil, completely eliminating the potential risk of silicone oil bleeding, thus protecting silicone-sensitive components and enhancing product reliability and environmental value. Its low-density properties significantly reduce product weight, aligning with the trend of slim and lightweight designs, lowering energy consumption, and reducing stress on small components.

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NL-putty06-s
6.0 W/m*K
Low outgassing
Silicone-free lightweight thermal gel contains no silicone oil, completely eliminating the potential risk of silicone oil bleeding, thus protecting silicone-sensitive components and enhancing product reliability and environmental value. Its low-density properties significantly reduce product weight, aligning with the trend of slim and lightweight designs, lowering energy consumption, and reducing stress on small components.
Datasheet Download

CATEGORY

Thermal Putty

FEATURES

/ Lightweight, Low Density, Thermal Conductivity: 6.0 W/m*K
/ High flow rate, extrusion rate under 90psi&60s conditions: 28g/min
/ Bond line thickness:100~1500µm
/ Non-silicone resin materials
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application

VERTICAL RELIABILITY

sing 1.5mm pad as a gap control, put the putty between the aluminum and the glass panel mark the initial position. Then, place it in the oven with 125℃ for 1,000 hours and observe its displacement after reliability test

TYPICAL APPLICATION

/ lightweight applications, such as Automotive electronic devices, Mobile communication device, Drone & aircraft,Sports and leisure electronic products, Portable computers and tablets,wearable devices, Portable game consoles, VR devices and etc.

TYPICAL PROPERTIES

PROPERTY NL-putty06-s UNIT TEST METHOD
Color Purple - Visual
Resin base Non-Silicone - -
Viscosity 6000 Pa.s DIN 53018
Flow Rate 28 g/min By LiPOLY
Density 2.6 g/cm³ ASTM D792
Application temperature -60~125 °C -
Bond line thickness 100~1500 μm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 6.0 W/m*K ASTM D5470
Thermal impedance@10psi / 60°C 0.059 °C-in²/ W ASTM D5470
Thermal impedance@30psi / 60°C 0.054 °C-in²/ W ASTM D5470

Related​ Product

Silicone-free lightweight thermal gel contains no silicone oil, completely eliminating the potential risk of silicone oil bleeding, thus protecting silicone-sensitive components and enhancing product reliability and environmental value. Its low-density properties significantly reduce product weight, aligning with the trend of slim and lightweight designs, lowering energy consumption, and reducing stress on small components.
NL-putty06-s
6.0 W/m*K
Low outgassing
Non-silicone lightweight thermal gel features a “non-silicone” property that prevents the silicone oil migration issues sometimes found in traditional silicone gels, effectively protecting optical or electronic components sensitive to silicone. Its “low-density” characteristic helps achieve product lightweighting and reduces stress on precision components.
NL-putty10-s
10.0 W/m*K
Low outgassing
Non-silicone low-density thermal putty is a specialized material designed for electronic thermal management. Unlike traditional silicone-based thermal materials, it contains no silicone oil, effectively preventing issues such as contact failure or contamination caused by silicone oil migration. This makes it especially suitable for optical or precision electronic components that are sensitive to silicone.
NL-putty04-s
4.0 W/m*K
Low outgassing
Non-silicone thermal gel differs from traditional TIMs in that it contains no silicone oil components. It effectively fills surface irregularities of electronic components while avoiding various silicone oil-related issues. Its advantages-no silicone oil contamination, no pump-out effect, excellent stability, and low thermal resistance-make it especially suitable for optical products, sensitive electronic components, and applications requiring high reliability.
N-putty5-s
9.0 W/m*K
Low outgassing
Silicon-Free Thermal Putty N-putty3-s with thermal conductivity of 7.0 W/m*K features no low-molecular siloxane volatilization, preventing electrical contact failures. It is ideal for optical products and sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and provides tolerance compensation. It overcomes issues like thermal paste overflow and drying out, and can be paired with LiPOLY's specialized putty dispensing machine for ideal automated production.
N-putty3-s
7.0 W/m*K
Low outgassing
Non-silicone thermal gel N-putty2-s features a thermal conductivity of 5.0 W/m*K and is free from low-molecular-weight siloxane volatiles, preventing electrical contact failures. It is ideal for optical products or sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and compensates for tolerances. It overcomes issues such as thermal grease overflow and drying. When used with LiPOLY's dedicated putty dispensing machine, it is an ideal choice for automated dispensing production.
N-putty2-s
5.0 W/m*K
Low outgassing
Non-silicone thermal putty is a high-performance thermal interface material that does not contain silicone oil or siloxane components. If your application requires avoiding silicone oil volatilization, is sensitive to silicone ingredients, or demands long-term stability, it is recommended to choose non-silicone thermal putty. These products are especially suitable for high-end applications such as optical components, automotive electronics, and servers, and can be customized to meet specific requirements.
N-putty-s
3.5 W/m*K
Low outgassing

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    LiPOLY® Advance TIMs

    桃園市八德區永豐路435號

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