RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
PK605
6.0 W/m*K
General Thermal
PK605 thermal pad is designed to reduce thermal interface resistance between heat sources and heat sinks, with wide applications from CPU/GPU cooling to automotive electronics. Compliant with RoHS/REACH , it is also suitable for medical equipment/food machinery. With Shore OO/60 hardness, it offers excellent flexibility, compressibility, insulation properties, and available with customized cutting and die-cutting services.

CATEGORY

FEATURES

/ Thermal conductivity: 6.0 W/m*K
/ Naturally tacky for ease of manufacture
/ Low thermal impedance
/ Available in a range of thicknesses

SPECIFICATIONS

/ Roll form
/ Sheet form
/ Die-cut parts

TYPICAL APPLICATION

/ Notebook computers
/ Heat pipe assemblies
/ Memory modules
/ TV hardware
/ Automotive electronics
/ Mobile devices
/ High speed mass storage drives
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY PK605 UNIT TEST METHOD
Color Red - Visual
Surface tack 2-side/1-side 2 - -
Thickness Customized mm ASTM D374
Density 3.2 g/cm³ ASTM D792
Hardness 60 Shore OO ASTM D2240
Application temperature -60~180 °C -
Dielectric breakdown 12 KV/mm ASTM D149
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 6.0 W/m*K ASTM D5470
Thermal impedance@10 psi 0.371 °C-in²/ W ASTM D5470
Thermal impedance@50 psi 0.262 °C-in²/ W ASTM D5470

Related​ Product

PK605
6.0 W/m*K
General Thermal

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    LiPOLY® Advance TIMs

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