RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
PK223
2.0 W/m*K
General Thermal
PK223 Thermal Pad is widely applied as a Thermal Interface Material (TIMs) that reduces interfacial thermal resistance between heat-generating components and heat dissipating parts, from CPU/GPU cooling to automotive electronic devices. Compliant with RoHS/REACH, it is also applicable to medical equipment and food machinery. Customizable die-cutting capabilities.

CATEGORY

FEATURES

/ Thermal conductivity: 2.0 W/m*K
/ Naturally tacky for ease of manufacture
/ Low thermal impedance
/ Available in a range of thicknesses

SPECIFICATIONS

/ Roll form
/ Sheet form
/ Die-cut parts

TYPICAL APPLICATION

/ Notebook computers
/ Heat pipe assemblies
/ Memory modules
/ TV hardware
/ Automotive electronics
/ Mobile devices
/ High speed mass storage drives
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY PK223 UNIT TEST METHOD
Color White - Visual
Surface tack 2-side/1-side 2 - -
Thickness Customized mm ASTM D374
Density 2.1 g/cm³ ASTM D792
Hardness 30 Shore OO ASTM D2240
Application temperature -60~180 °C -
Dielectric breakdown 11 KV/mm ASTM D149
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 2.0 W/m*K ASTM D5470
Thermal impedance@10 psi 0.711 °C-in²/ W ASTM D5470
Thermal impedance@50 psi 0.572 °C-in²/ W ASTM D5470

Related​ Product

PK223
2.0 W/m*K
General Thermal

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    熱介面管理專家

    LiPOLY® Advance TIMs

    桃園市八德區永豐路435號

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