PK700
7.0 W/m*K
General Thermal
液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
PK223
2.0 W/m*K
General Thermal
PK223熱傳導係數：2.0 W / m*K的間隙填充材料。硬度Shore OO/30具有柔韌性、壓縮性、絕緣性、自黏性佳，可填補機構設計的正負公差，顯示出高穩定的特性,可客製化裁切沖型。
CATEGORY
FEATURES
/ Thermal conductivity: 2.0 W/m*K
/ Naturally tacky for ease of manufacture
/ Low thermal impedance
/ Available in a range of thicknesses
SPECIFICATIONS
/ Roll form
/ Sheet form
/ Die-cut parts
TYPICAL APPLICATION
/ Notebook computers
/ Heat pipe assemblies
/ Memory modules
/ TV hardware
/ Automotive electronics
/ Mobile devices
/ High speed mass storage drives
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | PK223 | TEST METHOD | UNIT |
|---|---|---|---|
| Color | White | Visual | - |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | ASTM D374 | mm |
| Density | 2.1 | ASTM D792 | g/cm³ |
| Hardness | 30 | ASTM D2240 | Shore OO |
| Application temperature | -60~180 | - | °C |
| Dielectric breakdown | 11 | ASTM D149 | KV/mm |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 2.0 | ASTM D5470 | W/m*K |
| Thermal impedance@10 psi | 0.711 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@50 psi | 0.572 | ASTM D5470 | °C-in²/ W |
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