Liquid
Solid
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Insulator
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PK223
2.0 W/m·K
General Series
PK223 Thermal Pad is widely applied as a Thermal Interface Material (TIMs) that reduces interfacial thermal resistance between heat-generating components and heat dissipating parts, from CPU/GPU cooling to automotive electronic devices. Compliant with RoHS/REACH, it is also applicable to medical equipment and food machinery. Customizable die-cutting capabilities.
CATEGORY
FEATURES
/ Thermal conductivity: 2.0 W/m·K
/ Naturally tacky for ease of manufacture
/ Extremely low thermal impedance
/ Available in a range of thicknesses
CONFIGURATIONS
/ Roll form
/ Sheets form
/ Die-cuts parts
TYPICAL APPLICATION
/ Notebook computers
/ Heat pipe assemblies
/ Memory modules
/ TV hardware
/ Automotive electronics
/ Mobile devices
/ High speed mass storage drives
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
| PROPERTY | PK223 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | White | - | Visual |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 2.1 | g/cm³ | ASTM D792 |
| Hardness | 30 | Shore OO | ASTM D2240 |
| Application temperature | -60~180 | °C | - |
| Dielectric breakdown | 11 | KV/mm | ASTM D149 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 2.0 | W/m·K | ASTM D5470 |
| Thermal impedance@10 psi | 0.711 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.572 | °C-in²/ W | ASTM D5470 |
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