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IECQ 080000

Non-silicone Liquid Gap Filler

Non-silicone liquid thermal interface material is a liquid or semi-liquid thermal conductive material that does not contain siloxane, mainly used for thermal management of high-precision electronic components or optical devices. It features excellent thermal conductivity and conformability, effectively filling the gaps between heat-generating components and heat sinks, while avoiding the issues of volatilization, contamination, or outgassing that may occur with traditional silicone-based materials.

Thermal Putty
Non-silicone lightweight thermal gel features a “non-silicone” property that prevents the silicone oil migration issues sometimes found in traditional silicone gels, effectively protecting optical or electronic components sensitive to silicone. Its “low-density” characteristic helps achieve product lightweighting and reduces stress on precision components.
NL-putty10-s
10.0 W/m*K
Low outgassing
Non-silicone thermal gel differs from traditional TIMs in that it contains no silicone oil components. It effectively fills surface irregularities of electronic components while avoiding various silicone oil-related issues. Its advantages-no silicone oil contamination, no pump-out effect, excellent stability, and low thermal resistance-make it especially suitable for optical products, sensitive electronic components, and applications requiring high reliability.
N-putty5-s
9.0 W/m*K
Low outgassing
Silicon-Free Thermal Putty N-putty3-s with thermal conductivity of 7.0 W/m*K features no low-molecular siloxane volatilization, preventing electrical contact failures. It is ideal for optical products and sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and provides tolerance compensation. It overcomes issues like thermal paste overflow and drying out, and can be paired with LiPOLY's specialized putty dispensing machine for ideal automated production.
N-putty3-s
7.0 W/m*K
Low outgassing
Silicone-free lightweight thermal gel contains no silicone oil, completely eliminating the potential risk of silicone oil bleeding, thus protecting silicone-sensitive components and enhancing product reliability and environmental value. Its low-density properties significantly reduce product weight, aligning with the trend of slim and lightweight designs, lowering energy consumption, and reducing stress on small components.
NL-putty06-s
6.0 W/m*K
Low outgassing
G3380NT Non-silicone thermal grease with a thermal conductivity of 6.0 W/m*K, featuring zero low-molecular-weight siloxane volatilization to prevent electrical contact failure. Ideal for optical products and sensitive electronic components, it offers extremely low thermal resistance and excellent thermal conductivity.
G3380NT
6.0 W/m*K
Low outgassing
Non-silicone thermal gel N-putty2-s features a thermal conductivity of 5.0 W/m*K and is free from low-molecular-weight siloxane volatiles, preventing electrical contact failures. It is ideal for optical products or sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and compensates for tolerances. It overcomes issues such as thermal grease overflow and drying. When used with LiPOLY's dedicated putty dispensing machine, it is an ideal choice for automated dispensing production.
N-putty2-s
5.0 W/m*K
Low outgassing
G3380NK是具有熱傳導係數：4.5 W/m*K的非矽型導熱膏，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，具有極低熱阻和良好的導熱性，已廣泛用於消費電子產品和微處理器的熱控制技術，當組件的溫度升高，潤滑脂的粘性會降低，可以潤濕界面元件
G3380NK
4.5 W/m*K
Low outgassing
Non-silicone low-density thermal putty is a specialized material designed for electronic thermal management. Unlike traditional silicone-based thermal materials, it contains no silicone oil, effectively preventing issues such as contact failure or contamination caused by silicone oil migration. This makes it especially suitable for optical or precision electronic components that are sensitive to silicone.
NL-putty04-s
4.0 W/m*K
Low outgassing
Non-silicone thermal putty is a high-performance thermal interface material that does not contain silicone oil or siloxane components. If your application requires avoiding silicone oil volatilization, is sensitive to silicone ingredients, or demands long-term stability, it is recommended to choose non-silicone thermal putty. These products are especially suitable for high-end applications such as optical components, automotive electronics, and servers, and can be customized to meet specific requirements.
N-putty-s
3.5 W/m*K
Low outgassing
G3380NJ is a non-silicone thermal grease with a thermal conductivity of 3.2 W/m*K. It contains no low-molecular-weight siloxane volatilization, preventing electrical contact failures. This makes it suitable for optical products and sensitive electronic components. Featuring extremely low thermal resistance and excellent heat conductivity.
G3380NJ
3.2 W/m*K
Low outgassing
導熱膠是一種結合導熱與黏接功能的材料，廣泛應用於電子元件與散熱結構的介面，能有效傳導熱量並提供機械固定。 NEP230 是非矽型雙劑導熱固定膠，可以在室溫或高溫下固化後具有良好的固定力，與導熱墊片相比，非矽型雙劑導熱固定膠不僅對部件產生低應力、高導熱性、低粘度，同時能保持絕緣性能，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。
NEP230
3.0 W/m*K
Low outgassing
PCB 導熱灌膠 EP770-s 是非矽型灌膠，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用。透過將液態膠體澆灌並固化於電子組件之間，可填滿電子器件周圍空氣空間的縫隙，形成長期且有效的防護層，可達到防水、防潮、耐震、電氣絕緣和保護關鍵線束等多重效果。
EP770-s
2.5 W/m*K
Low outgassing
Non-silicone lightweight thermal gel features a “non-silicone” property that prevents the silicone oil migration issues sometimes found in traditional silicone gels, effectively protecting optical or electronic components sensitive to silicone. Its “low-density” characteristic helps achieve product lightweighting and reduces stress on precision components.
NL-putty10-s
10.0 W/m*K
Low outgassing
Non-silicone thermal gel differs from traditional TIMs in that it contains no silicone oil components. It effectively fills surface irregularities of electronic components while avoiding various silicone oil-related issues. Its advantages-no silicone oil contamination, no pump-out effect, excellent stability, and low thermal resistance-make it especially suitable for optical products, sensitive electronic components, and applications requiring high reliability.
N-putty5-s
9.0 W/m*K
Low outgassing
Silicon-Free Thermal Putty N-putty3-s with thermal conductivity of 7.0 W/m*K features no low-molecular siloxane volatilization, preventing electrical contact failures. It is ideal for optical products and sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and provides tolerance compensation. It overcomes issues like thermal paste overflow and drying out, and can be paired with LiPOLY's specialized putty dispensing machine for ideal automated production.
N-putty3-s
7.0 W/m*K
Low outgassing
Silicone-free lightweight thermal gel contains no silicone oil, completely eliminating the potential risk of silicone oil bleeding, thus protecting silicone-sensitive components and enhancing product reliability and environmental value. Its low-density properties significantly reduce product weight, aligning with the trend of slim and lightweight designs, lowering energy consumption, and reducing stress on small components.
NL-putty06-s
6.0 W/m*K
Low outgassing
G3380NT Non-silicone thermal grease with a thermal conductivity of 6.0 W/m*K, featuring zero low-molecular-weight siloxane volatilization to prevent electrical contact failure. Ideal for optical products and sensitive electronic components, it offers extremely low thermal resistance and excellent thermal conductivity.
G3380NT
6.0 W/m*K
Low outgassing
Non-silicone thermal gel N-putty2-s features a thermal conductivity of 5.0 W/m*K and is free from low-molecular-weight siloxane volatiles, preventing electrical contact failures. It is ideal for optical products or sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and compensates for tolerances. It overcomes issues such as thermal grease overflow and drying. When used with LiPOLY's dedicated putty dispensing machine, it is an ideal choice for automated dispensing production.
N-putty2-s
5.0 W/m*K
Low outgassing
G3380NK是具有熱傳導係數：4.5 W/m*K的非矽型導熱膏，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，具有極低熱阻和良好的導熱性，已廣泛用於消費電子產品和微處理器的熱控制技術，當組件的溫度升高，潤滑脂的粘性會降低，可以潤濕界面元件
G3380NK
4.5 W/m*K
Low outgassing
Non-silicone low-density thermal putty is a specialized material designed for electronic thermal management. Unlike traditional silicone-based thermal materials, it contains no silicone oil, effectively preventing issues such as contact failure or contamination caused by silicone oil migration. This makes it especially suitable for optical or precision electronic components that are sensitive to silicone.
NL-putty04-s
4.0 W/m*K
Low outgassing
Non-silicone thermal putty is a high-performance thermal interface material that does not contain silicone oil or siloxane components. If your application requires avoiding silicone oil volatilization, is sensitive to silicone ingredients, or demands long-term stability, it is recommended to choose non-silicone thermal putty. These products are especially suitable for high-end applications such as optical components, automotive electronics, and servers, and can be customized to meet specific requirements.
N-putty-s
3.5 W/m*K
Low outgassing
G3380NJ is a non-silicone thermal grease with a thermal conductivity of 3.2 W/m*K. It contains no low-molecular-weight siloxane volatilization, preventing electrical contact failures. This makes it suitable for optical products and sensitive electronic components. Featuring extremely low thermal resistance and excellent heat conductivity.
G3380NJ
3.2 W/m*K
Low outgassing
導熱膠是一種結合導熱與黏接功能的材料，廣泛應用於電子元件與散熱結構的介面，能有效傳導熱量並提供機械固定。 NEP230 是非矽型雙劑導熱固定膠，可以在室溫或高溫下固化後具有良好的固定力，與導熱墊片相比，非矽型雙劑導熱固定膠不僅對部件產生低應力、高導熱性、低粘度，同時能保持絕緣性能，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。
NEP230
3.0 W/m*K
Low outgassing
PCB 導熱灌膠 EP770-s 是非矽型灌膠，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用。透過將液態膠體澆灌並固化於電子組件之間，可填滿電子器件周圍空氣空間的縫隙，形成長期且有效的防護層，可達到防水、防潮、耐震、電氣絕緣和保護關鍵線束等多重效果。
EP770-s
2.5 W/m*K
Low outgassing
Non-silicone lightweight thermal gel features a “non-silicone” property that prevents the silicone oil migration issues sometimes found in traditional silicone gels, effectively protecting optical or electronic components sensitive to silicone. Its “low-density” characteristic helps achieve product lightweighting and reduces stress on precision components.
NL-putty10-s
10.0 W/m*K
Low outgassing
Non-silicone thermal gel differs from traditional TIMs in that it contains no silicone oil components. It effectively fills surface irregularities of electronic components while avoiding various silicone oil-related issues. Its advantages-no silicone oil contamination, no pump-out effect, excellent stability, and low thermal resistance-make it especially suitable for optical products, sensitive electronic components, and applications requiring high reliability.
N-putty5-s
9.0 W/m*K
Low outgassing
Silicon-Free Thermal Putty N-putty3-s with thermal conductivity of 7.0 W/m*K features no low-molecular siloxane volatilization, preventing electrical contact failures. It is ideal for optical products and sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and provides tolerance compensation. It overcomes issues like thermal paste overflow and drying out, and can be paired with LiPOLY's specialized putty dispensing machine for ideal automated production.
N-putty3-s
7.0 W/m*K
Low outgassing
Silicone-free lightweight thermal gel contains no silicone oil, completely eliminating the potential risk of silicone oil bleeding, thus protecting silicone-sensitive components and enhancing product reliability and environmental value. Its low-density properties significantly reduce product weight, aligning with the trend of slim and lightweight designs, lowering energy consumption, and reducing stress on small components.
NL-putty06-s
6.0 W/m*K
Low outgassing
G3380NT Non-silicone thermal grease with a thermal conductivity of 6.0 W/m*K, featuring zero low-molecular-weight siloxane volatilization to prevent electrical contact failure. Ideal for optical products and sensitive electronic components, it offers extremely low thermal resistance and excellent thermal conductivity.
G3380NT
6.0 W/m*K
Low outgassing
Non-silicone thermal gel N-putty2-s features a thermal conductivity of 5.0 W/m*K and is free from low-molecular-weight siloxane volatiles, preventing electrical contact failures. It is ideal for optical products or sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and compensates for tolerances. It overcomes issues such as thermal grease overflow and drying. When used with LiPOLY's dedicated putty dispensing machine, it is an ideal choice for automated dispensing production.
N-putty2-s
5.0 W/m*K
Low outgassing
G3380NK是具有熱傳導係數：4.5 W/m*K的非矽型導熱膏，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，具有極低熱阻和良好的導熱性，已廣泛用於消費電子產品和微處理器的熱控制技術，當組件的溫度升高，潤滑脂的粘性會降低，可以潤濕界面元件
G3380NK
4.5 W/m*K
Low outgassing
Non-silicone low-density thermal putty is a specialized material designed for electronic thermal management. Unlike traditional silicone-based thermal materials, it contains no silicone oil, effectively preventing issues such as contact failure or contamination caused by silicone oil migration. This makes it especially suitable for optical or precision electronic components that are sensitive to silicone.
NL-putty04-s
4.0 W/m*K
Low outgassing
Non-silicone thermal putty is a high-performance thermal interface material that does not contain silicone oil or siloxane components. If your application requires avoiding silicone oil volatilization, is sensitive to silicone ingredients, or demands long-term stability, it is recommended to choose non-silicone thermal putty. These products are especially suitable for high-end applications such as optical components, automotive electronics, and servers, and can be customized to meet specific requirements.
N-putty-s
3.5 W/m*K
Low outgassing
G3380NJ is a non-silicone thermal grease with a thermal conductivity of 3.2 W/m*K. It contains no low-molecular-weight siloxane volatilization, preventing electrical contact failures. This makes it suitable for optical products and sensitive electronic components. Featuring extremely low thermal resistance and excellent heat conductivity.
G3380NJ
3.2 W/m*K
Low outgassing
導熱膠是一種結合導熱與黏接功能的材料，廣泛應用於電子元件與散熱結構的介面，能有效傳導熱量並提供機械固定。 NEP230 是非矽型雙劑導熱固定膠，可以在室溫或高溫下固化後具有良好的固定力，與導熱墊片相比，非矽型雙劑導熱固定膠不僅對部件產生低應力、高導熱性、低粘度，同時能保持絕緣性能，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。
NEP230
3.0 W/m*K
Low outgassing
PCB 導熱灌膠 EP770-s 是非矽型灌膠，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用。透過將液態膠體澆灌並固化於電子組件之間，可填滿電子器件周圍空氣空間的縫隙，形成長期且有效的防護層，可達到防水、防潮、耐震、電氣絕緣和保護關鍵線束等多重效果。
EP770-s
2.5 W/m*K
Low outgassing

熱介面管理專家

LiPOLY® Advance TIMs

桃園市八德區永豐路435號

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