液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
PK223
2.0 W/m·K
General Thermal
PK223 導熱片是降低發熱源與散熱器介面接觸熱阻的導熱界面材料，從CPU/GPU冷卻到車載電子設備都有廣泛應用。符合RoHS指令/REACH法規，也可適用於醫療設備/食品機械。硬度Shore OO/30具有柔韌性、壓縮性、絕緣性、自黏性佳，可填補機構設計的正負公差，可客製化裁切沖型。
CATEGORY
FEATURES
/ Thermal conductivity: 2.0 W/m*K
/ Naturally tacky for ease of manufacture
/ Low thermal impedance
/ Available in a range of thicknesses
SPECIFICATIONS
/ Roll form
/ Sheet form
/ Die-cut parts
TYPICAL APPLICATION
/ Notebook computers
/ Heat pipe assemblies
/ Memory modules
/ TV hardware
/ Automotive electronics
/ Mobile devices
/ High speed mass storage drives
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | PK223 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | White | - | Visual |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 2.1 | g/cm³ | ASTM D792 |
| Hardness | 30 | Shore OO | ASTM D2240 |
| Application temperature | -60~180 | °C | - |
| Dielectric breakdown | 11 | KV/mm | ASTM D149 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 2.0 | W/m*K | ASTM D5470 |
| Thermal impedance@10 psi | 0.711 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.572 | °C-in²/ W | ASTM D5470 |
Related Product
PK700
7.0 W/m·K
General Thermal
PK605
6.0 W/m·K
General Thermal
PK504
5.0 W/m·K
General Thermal
PK404
4.0 W/m·K
General Thermal