RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
DTT65-s
5.0 W/m*K
Shore OO 55
DTT65-s是一種低密度的導熱墊片。低密度、輕量化特性,可為產品提高其性能、降低生產成本及減少材料的使用和能源消耗等,常被應用在電子產品及汽車電子設備上。產品導熱係數 5.0 W/m*K,特性專為網絡通信訊號傳輸而設計,專注於 Dk 和 Df減少射頻模塊中的干擾,硬度Shore OO 55具有柔韌性、壓縮性、絕緣性、自黏性佳,可填補機構設計的正負公差,顯示出高穩定的特性,可客製化裁切沖型。

CATEGORY

Thermal Putty

FEATURES

/ Lightweight, Low Density
/ Thermal conductivity: 5.0 W/m*K
/ Hardness: Shore OO/55
/ Low dielectric constant
/ For high frequency applications
/ Available in a range of thicknesses

SPECIFICATIONS

/ Sheet form
/ Die-cut parts

TYPICAL APPLICATION

/ Communications satellite
/ Satellite positioning devices
/ IoT devices
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY DTT65-s TEST METHOD UNIT
Color Red Visual -
Surface tack 2-side/1-side 2 - -
Thickness Customized ASTM D374 mm
Density 2.1 ASTM D792 g/cm³
Hardness 55 ASTM D2240 Shore OO
Water absorption 0.005 ASTM D570 %
Application temperature -60~180 - °C
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 5.0 ASTM D5470 W/m*K
Thermal impedance@10 psi 0.350 ASTM D5470 °C-in²/ W
Thermal impedance@20 psi 0.342 ASTM D5470 °C-in²/ W

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