Thermal adhesive is a thermally conductive material specifically designed for high-efficiency heat conduction, primarily used to fill gaps between electronic components and heat sinks to improve heat dissipation efficiency. It can effectively conduct heat and prevent air infiltration, reducing thermal resistance. PK404DM can cure at room temperature or high temperature. Compared to thermal pads, thermal gap filler not only produces low stress on components with high thermal conductivity and low viscosity, but also maintains insulation performance.