Thermal gap filler is primarily used to fill the gaps between electronic components and heat sinks, enhancing heat dissipation efficiency. It effectively conducts heat and prevents air ingress, thereby reducing thermal resistance. PK404DM can cure at room temperature or high temperatures. Compared to thermal pads, thermal gap filler applies low stress to components, offers high thermal conductivity, low viscosity, and maintains insulation properties. It is also an ideal choice for automated dispensing production when paired with LiPOLY’s dedicated putty dispensing machine.