Thermal Gap Filler PK223DM is a gel designed to fill gaps between electronic components to enhance heat dissipation efficiency. It can cure at room temperature or high temperatures. Compared to thermal pads, this two-part thermal gap filler not only applies low stress to components, offers high thermal conductivity, and low viscosity, but also maintains insulation properties. It is an ideal gap-filling material for use with LiPOLY's dedicated putty intelligent dispenser, making it suitable for automated dispensing production lines.