RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
SH-putty3
8.0 W/m*K
No Vertical Flow
Thermal gel, compared to thermal grease, features non-flowing and anti-sagging properties, making it easier to clean. It can replace thermal pads and offers characteristics such as low oil bleed and non-flowing behavior. Thermal gel can fill larger gaps and simultaneously encapsulate various irregular components, maintaining stability even at high temperatures. Additionally, it provides higher dielectric breakdown voltage insulation, making it suitable for high-power electronic and electrical components.

CATEGORY

Thermal Putty

FEATURES

/ Thermal conductivity: 8.0 W/m*K
/ Bond line thickness:100-3000µm
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application

CONFIGURATIONS

/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY SH-putty3 UNIT TEST METHOD
Color Gray - Visual
Resin base Silicone - -
Viscosity 17000 Pa.s DIN 53018
Flow Rate 32 g/min By LiPOLY
Density 3.4 g/cm³ ASTM D792
Application temperature -60~180 °C -
Bond line thickness 100~3000 μm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 8.0 W/m*K ASTM D5470
Thermal impedance@10psi / 60°C 0.039 °C-in²/ W ASTM D5470
Thermal impedance@50psi / 60°C 0.031 °C-in²/ W ASTM D5470

Related​ Product

SH-putty3
8.0 W/m*K
No Vertical Flow

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    熱介面管理專家

    LiPOLY® Advance TIMs

    桃園市八德區永豐路435號

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