Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
/ Thermal conductivity:10.0 W/m*K
/ Bond line thickness:200-3000µm
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application
/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg
/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
PROPERTY | S-putty5-s | UNIT | TEST METHOD |
---|---|---|---|
Color | Blue | - | Visual |
Resin base | Silicone | - | - |
Viscosity | 20000 | Pa.s | DIN 53018 |
Flow Rate | 23 | g/min | By LiPOLY |
Density | 3.3 | g/cm³ | ASTM D792 |
Application temperature | -60~180 | °C | - |
Dielectric breakdown | 12 | KV/mm | ASTM D149 |
ROHS & REACH | Compliant | - | - |
THERMAL | |||
Thermal conductivity | 10.0 | W/m*K | ASTM D5470 |
Thermal impedance@10psi / 60°C | 0.035 | °C-in²/ W | ASTM D5470 |
Thermal impedance@50psi / 60°C | 0.027 | °C-in²/ W | ASTM D5470 |