RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
S-putty5-s
10.0 W/m*K
No Vertical Flow
Thermal putty features a softness and hardness level between thermal grease and thermal pads. It offers greater durability than thermal grease and better conformability than thermal pads. Its soft texture makes it easy to apply and fill, providing excellent plasticity to accommodate uneven surfaces and eliminate air gaps. Additionally, thermal putty is nearly non-hardening, so it does not introduce internal stress to equipment after application, and it is easier to handle compared to thermal grease.

CATEGORY

Thermal Putty

FEATURES

/ Thermal conductivity:10.0 W/m*K
/ Bond line thickness:200-3000µm
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application

CONFIGURATIONS

/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM

TYPICAL PROPERTIES

PROPERTY S-putty5-s UNIT TEST METHOD
Color Blue - Visual
Resin base Silicone - -
Viscosity 20000 Pa.s DIN 53018
Flow Rate 23 g/min By LiPOLY
Density 3.3 g/cm³ ASTM D792
Application temperature -60~180 °C -
Dielectric breakdown 12 KV/mm ASTM D149
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 10.0 W/m*K ASTM D5470
Thermal impedance@10psi / 60°C 0.035 °C-in²/ W ASTM D5470
Thermal impedance@50psi / 60°C 0.027 °C-in²/ W ASTM D5470

Related​ Product

S-putty5-s
10.0 W/m*K
No Vertical Flow

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    熱介面管理專家

    LiPOLY® Advance TIMs

    桃園市八德區永豐路435號

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