RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
S-putty2-s
6.0 W/m*K
No Vertical Flow
Thermal silicone putty is a polymer thermal interface material made with a silicone base and added thermal conductive fillers. It offers both electrical insulation and mechanical protection, efficiently transferring and dissipating heat. Thermal silicone is primarily used for thermal management and heat dissipation in industries such as electronics, electrical engineering, automotive, and lighting. Due to its high thermal conductivity, insulation, softness, and high-temperature resistance, thermal silicone has become an indispensable material for thermal management in modern electronic and electrical products.

CATEGORY

Thermal Putty

FEATURES

/ Thermal conductivity:6.0 W/m*K
/ Bond line thickness:100-1500µm
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application

CONFIGURATIONS

/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY S-putty2-s UNIT TEST METHOD
Color Blue - Visual
Resin base Silicone - -
Viscosity 3500 Pa.s DIN 53018
Flow Rate 21 g/min By LiPOLY
Density 3.3 g/cm³ ASTM D792
Application temperature -60~180 °C -
Bond line thickness 100~1500 μm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 6.0 W/m*K ASTM D5470
Thermal impedance@10psi / 60°C 0.062 °C-in²/ W ASTM D5470
Thermal impedance@50psi / 60°C 0.053 °C-in²/ W ASTM D5470

Related​ Product

S-putty2-s
6.0 W/m*K
No Vertical Flow

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    LiPOLY® Advance TIMs

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