SH-putty3
8.0 W/m*K
No Vertical Flow
液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
H-putty
3.5 W/m*K
No Vertical Flow
H-putty 是具有熱傳導係數：3.5 W/m*K的導熱凝膠間隙填充材料，高變形量體，極低的熱阻值及低應力，可靈活性的適配間隙，兼具公差補償特性，可以克服類似導熱膏溢流、乾凅問題，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。
CATEGORY
Thermal Putty
FEATURES
/ Thermal conductivity:3.5 W/m*K
/ Bond line thickness:100-3000µm
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application
CONFIGURATIONS
/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg
TYPICAL APPLICATION
/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | H-putty | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Blue | Visual | - |
| Resin base | Silicone | - | - |
| Viscosity | 15000 | DIN 53018 | Pa.s |
| Density | 3.0 | ASTM D792 | g/cm³ |
| Application temperature | -60~180 | - | °C |
| Bond line thickness | 100~3000 | - | μm |
| Dielectric breakdown | 12 | ASTM D149 | KV/mm |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 3.5 | ASTM D5470 | W/m*K |
| Thermal impedance@10psi / 60°C | 0.076 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@50psi / 60°C | 0.069 | ASTM D5470 | °C-in²/ W |
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