Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
New, Silicone・TIMs ——
Low-density thermal pad made from magnetic materials and silicone resin composite offers both high thermal conductivity and EMI absorption. It fills microscopic gaps between heat sources and heatsinks to reduce thermal resistance while suppressing chip-to-chip interference, enhancing signal quality and safety in medical equipment.
CATEGORY
FEATURES
/ Lightweight, Low Density
/ Thermal conductivity: 5.0 W/m·K
/ Hardness: Shore OO/55
/ Low dielectric constant
/ For high frequency applications
/ Available in a range of thicknesses
CONFIGURATIONS
/ Sheets form
/ Die-cuts parts
TYPICAL APPLICATION
/ Communications satellite
/ Satellite positioning devices
/ IoT devices
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
| PROPERTY | DTT65-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Red | - | Visual |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 2.1 | g/cm³ | ASTM D792 |
| Hardness | 55 | Shore OO | ASTM D2240 |
| Water absorption | 0.005 | % | ASTM D570 |
| Application temperature | -60~180 | °C | - |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 5.0 | W/m·K | ASTM D5470 |
| Thermal impedance@10 psi | 0.350 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@20 psi | 0.342 | °C-in²/ W | ASTM D5470 |
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