RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Liquid series

Thermal liquid gap fillers are high-flow, thermally conductive materials designed to fill gaps between electronic components and heat sinks. Compared to traditional thermal pads, these liquids can fully cover irregular surfaces, ensuring superior heat transfer performance. They are suitable for applications with high thermal demands, such as electric vehicle battery modules, servers, and LED lighting systems.

Thermal Putty
TPS586
1.5 W/m·K
Sealing Glue
G3380NA
1.3 W/m·K
Low outgassing
G3380A
1.3 W/m·K
Low minimum bond line
TPS589
0.8 W/m·K
Sealing Glue
TPS31
0.55 W/m·K
Sealing Glue

Expert Thermal Solutions

LiPOLY® Advance TIMs

Taoyuan City, Bade District, Yongfeng Road, No. 435

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