液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
PK700DM
7.0 W/m·K
Fast Curing in room temperature
導熱填縫膠用於填充發熱器件和散熱器件之間的間隙，改善熱傳導，降低熱阻。它通常呈粘稠液體或半固體狀，適用於需要精確填充微小間隙的場合，例如處理器和散熱器之間。熱傳導係數7.0W/m*K的PK700DM可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。
CATEGORY
Thermal Putty
FEATURES
/ Thermal conductivity: 7.0 W/m*K
/ Fast curing in normal atmospheric temperature
/ Great reliability
/ Great sealing in low pressure
CONFIGURATIONS
/ Cartridges: 50ml, 400ml
/ Other special and custom sizes are available upon request
TYPICAL APPLICATION
/ Between CPU and heat sink
/ Between a component and heat sink
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ Electric vehicle& Automotive battery
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | PK700DM | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray-A White-B | - | Visual |
| Solid content | Two-part : 100:100 | - | - |
| Viscosity A | 315 | Pa.s | ISO 3219 |
| Viscosity B | 285 | Pa.s | ISO 3219 |
| Density | 2.8 | g/cm³ | ASTM D792 |
| Shelf life | 24 months | - | - |
| Hardness (AFTER CURE) | 60 | Shore OO | ASTM D2240 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 7.0 | W/m*K | ASTM D5470 |
| Thermal impedance@10mils BLT | 0.058 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@30mils BLT | 0.170 | °C-in²/ W | ASTM D5470 |
Related Product
PK605DM
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PK223DM
2.2 W/m·K
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