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G3380NK
4.5 W/m·K
Low outgassing
Non-silicone thermal grease is especially suitable for applications sensitive to siloxane volatilization, or requiring high cleanliness and high reliability, such as optical, medical, semiconductor, and high-end electronic products. By applying the thermal grease to the CPU surface, it effectively eliminates excess air between the processor and the heat sink, delivering high thermal conductivity performance.
CATEGORY
FEATURES
/ Thermal conductivity: 4.5 W/m·K
/ Low outgassing
/ Low thermal impedance
/ 未開封且於室溫25℃下可保存60個月。
CONFIGURATIONS
/ Tinplate Can:1kg
/ Other special and custom sizes are available upon request
TYPICAL APPLICATION
/ CPU and chip coolers
/ Switching power supplies
/ LED appliance
/ Between any heat-generating component and heat sink
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | G3380NK | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | - | Visual |
| Resin Base | Non-Silicone | - | - |
| Filler | Non-Metal | - | - |
| Viscosity | 106 | ISO 3219 | |
| Density | 2.7 | g/cm³ | ASTM D792 |
| Application temperature | -60~150 | °C | - |
| Bond Line Thickness | 27 | μm | - |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 4.5 | W/m·K | ASTM D5470 |
| Thermal impedance@50psi | 0.02 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50psi | 12.9 | °C-mm²/ W | ASTM D5470 |
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