G3380NK
4.5 W/m*K
Low outgassing
Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
G3380NT
6.0 W/m*K
Low outgassing
After applying thermal grease to the CPU surface, it effectively eliminates excess air between the processor and the heatsink, enabling efficient heat transfer and allowing the heat generated by the CPU to be quickly transmitted to the heatsink, thereby improving the overall cooling performance of the computer. G3380NT features a high thermal conductivity of 6.0 W/m*K, is free from low molecular weight siloxane volatilization, and will not cause electrical contact failure, making it suitable for use in optical products or sensitive electronic components.
CATEGORY
FEATURES
/ Thermal conductivity: 6.0 W/m*K
/ Low outgassing
/ Low thermal impedance
// It can be preserved for 60 months under the condition of unopened and under room temperature 25℃.
CONFIGURATIONS
/ Tinplate Can:1kg
/ Other special and custom sizes are available upon request
TYPICAL APPLICATION
/ CPU and chip coolers
/ Switching power supplies
/ LED appliance
/ Between any heat-generating component and heat sink
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | G3380NT | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | - | Visual |
| Resin base | Non-Silicone | - | - |
| Filler | Non-Metal | - | - |
| Viscosity | 146 | ISO 3219 | |
| Density | 2.8 | g/cm³ | ASTM D792 |
| Application temperature | -60~150 | °C | - |
| Bond line thickness | 30 | μm | - |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 6.0 | W/m*K | ASTM D5470 |
| Thermal impedance@50psi | 0.01 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50psi | 6.4 | °C-mm²/ W | ASTM D5470 |
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