G3380NK
4.5 W/m*K
Low outgassing
液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
非矽型 · 導熱材料 ——
G3380NT
6.0 W/m*K
Low outgassing
將導熱膏塗抹在CPU表面後，就能有效排除處理器與散熱器之間多餘的空氣，發揮高效能的導熱效果，讓CPU產生的熱能更快速地傳遞到散熱器，進而提升電腦整體散熱表現。
G3380NT是具有熱傳導係數：6.0 W/m*K的非矽型導熱膏，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，具有極低熱阻和良好的導熱性，已廣泛用於消費電子產品和微處理器的熱控制技術，當組件的溫度升高，潤滑脂的粘性會降低，可以潤濕界面元件
CATEGORY
FEATURES
/ Thermal conductivity: 6.0 W/m*K
/ Low outgassing
/ Low thermal impedance
// It can be preserved for 60 months under the condition of unopened and under room temperature 25℃.
CONFIGURATIONS
/ Tinplate Can:1kg
/ Other special and custom sizes are available upon request
TYPICAL APPLICATION
/ CPU and chip coolers
/ Switching power supplies
/ LED appliance
/ Between any heat-generating component and heat sink
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | G3380NT | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Gray | Visual | - |
| Resin base | Non-Silicone | - | - |
| Filler | Non-Metal | - | - |
| Viscosity | 146 | ISO 3219 | |
| Density | 2.8 | ASTM D792 | g/cm³ |
| Application temperature | -60~150 | - | °C |
| Bond line thickness | 30 | - | μm |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 6.0 | ASTM D5470 | W/m*K |
| Thermal impedance@50psi | 0.01 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@50psi | 6.4 | ASTM D5470 | °C-mm²/ W |
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