RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
DTT13-s
13.0 W/m*K
No Vertical Flow
Lightweight thermal putty is a low-density, lightweight thermal material commonly used in lightweight drones and EV (electric vehicle) components. For lightweight drones, reducing weight can directly extend flight endurance, as battery weight accounts for a large proportion; lowering the weight effectively improves the endurance per unit of electrical energy. In electric vehicles, lightweight design also reduces energy consumption and increases battery range.

CATEGORY

Thermal Putty

FEATURES

/ Thermal conductivity:13.0 W/m*K
/ Bond line thickness:200-3000µm
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression andlow stress application

VERTICAL RELIABILITY

Using 3.0mm pad as a gap control, put the putty between the aluminum and the glass panel mark the initial position. Then, place it in the oven with 125℃ for 1,000 hours and observe itsdisplacement after reliability test

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY DTT13-s UNIT TEST METHOD
Color Gray - Visual
Resin base Silicone - -
Viscosity 20000 Pa.s DIN 53018
Flow Rate 17 g/min By LiPOLY
Density 3.3 g/cm³ ASTM D792
Application temperature -60~180 °C -
Bond line thickness 200~3000 μm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 13.0 W/m*K ASTM D5470
Thermal impedance@10psi / 60°C 0.031 °C-in²/ W ASTM D5470
Thermal impedance@50psi / 60°C 0.024 °C-in²/ W ASTM D5470

Related​ Product

DTT13-s
13.0 W/m*K
No Vertical Flow

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    LiPOLY® Advance TIMs

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