Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
/ Thermal conductivity:13.0 W/m*K
/ Bond line thickness:200-3000µm
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression andlow stress application
Using 3.0mm pad as a gap control, put the putty between the aluminum and the glass panel mark the initial position. Then, place it in the oven with 125℃ for 1,000 hours and observe itsdisplacement after reliability test
/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
PROPERTY | DTT13-s | UNIT | TEST METHOD |
---|---|---|---|
Color | Gray | - | Visual |
Resin base | Silicone | - | - |
Viscosity | 20000 | Pa.s | DIN 53018 |
Flow Rate | 17 | g/min | By LiPOLY |
Density | 3.3 | g/cm³ | ASTM D792 |
Application temperature | -60~180 | °C | - |
Bond line thickness | 200~3000 | μm | - |
ROHS & REACH | Compliant | - | - |
THERMAL | |||
Thermal conductivity | 13.0 | W/m*K | ASTM D5470 |
Thermal impedance@10psi / 60°C | 0.031 | °C-in²/ W | ASTM D5470 |
Thermal impedance@50psi / 60°C | 0.024 | °C-in²/ W | ASTM D5470 |