SH-putty3
8.0 W/m*K
No Vertical Flow
液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
DTT13-s
13.0 W/m*K
No Vertical Flow
DTT13-s 輕量化導熱膠泥是一種低密度的凝膠填縫材料。低密度、輕量化特性，可為產品提高其性能、降低生產成本及減少材料的使用和能源消耗等，常被應用在電子產品及汽車電子設備上。產品導熱係數 13.0 W/m*K，具有高變形量，可靈活性的適配間隙，兼具公差補償特性.可克服溢流乾凅問題, 提高熱傳導，適合自動化點膠生產。
CATEGORY
Thermal Putty
FEATURES
/ Thermal conductivity:13.0 W/m*K
/ Bond line thickness:200-3000µm
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression andlow stress application
VERTICAL RELIABILITY
Using 3.0mm pad as a gap control, put the putty between the aluminum and the glass panel mark the initial position. Then, place it in the oven with 125℃ for 1,000 hours and observe itsdisplacement after reliability test
TYPICAL APPLICATION
/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | DTT13-s | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Gray | Visual | - |
| Resin base | Silicone | - | - |
| Viscosity | 20000 | DIN 53018 | Pa.s |
| Flow Rate | 17 | By LiPOLY | g/min |
| Density | 3.3 | ASTM D792 | g/cm³ |
| Application temperature | -60~180 | - | °C |
| Bond line thickness | 200~3000 | - | μm |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 13.0 | ASTM D5470 | W/m*K |
| Thermal impedance@10psi / 60°C | 0.031 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@50psi / 60°C | 0.024 | ASTM D5470 | °C-in²/ W |
Related Product
DTT13-s
13.0 W/m*K
No Vertical Flow
S-putty5-s
10.0 W/m*K
No Vertical Flow
S-putty2-s
6.0 W/m*K
No Vertical Flow
S-putty
3.5 W/m*K
No Vertical Flow
H-putty2
6.0 W/m*K
No Vertical Flow
H-putty
3.5 W/m*K
No Vertical Flow