Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
DTT44-s
3.0 W/m·K
Lightweight
Lightweight thermal pads combine superior thermal conductivity with EMI absorption capabilities, designed for 5G base stations and high-density electronics. Custom cutting and die-cutting services available for diverse thermal management applications.
CATEGORY
FEATURES
/ Lightweight, Low Density Thermal conductivity: 3.0 W/m·K
/ Hardness: Shore OO/50
/ Low dielectric constant
/ For high frequency applications
/ Available in a range of thicknesses
CONFIGURATIONS
/ Sheets form
/ Die-cuts parts
TYPICAL APPLICATION
/ Communications satellite
/ Satellite positioning devices
/ IoT devices
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
| PROPERTY | DTT44-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Blue | - | Visual |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 2.2 | g/cm³ | ASTM D792 |
| Hardness | 50 | Shore OO | ASTM D2240 |
| Water absorption | 0.02 | % | ASTM D570 |
| Application temperature | -60~180 | °C | - |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 3.0 | W/m·K | ASTM D5470 |
| Thermal impedance@10 psi | 0.652 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@20 psi | 0.630 | °C-in²/ W | ASTM D5470 |
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