Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
New, Silicone・TIMs ——
AS50-s
5.0 W/m·K
Shore OO/25
Fiberglass reinforced layer Thermal Pad is a thermal interface material that incorporates one or more layers of glass fiber cloth as reinforcement on a thermally conductive silicone substrate to enhance toughness, tensile strength, and puncture resistance while improving mechanical strength and insulation performance without compromising the thermal conductivity characteristics of the thermal silicone pad itself.
CATEGORY
FEATURES
/ Thermal conductivity: 5.0 W/m·K
/ Designed for manufacturing
/ High dielectric breakdown
/ Shock and vibration absorber
/ Good mechanical strength
/ Fiberglass reinforced
CONFIGURATIONS
/ Roll form
/ Sheets form
/ Die-cuts parts
TYPICAL APPLICATION
/ Between a component and heat sink
/ Flat-panel displays
/ LED, HDDs, DVDs
/ Heat pipe assemblies
/ Memory modules
/ Power supplies
/ 5G base station & infrastructure
/ EV electric vehicle
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
| PROPERTY | AS50-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | - | Visual |
| Surface tack 2-side/1-side | 1 | - | - |
| Reinforced layer | Fiberglass | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.1 | g/cm³ | ASTM D792 |
| Hardness | 25 | Shore OO | ASTM D2240 |
| Application temperature | -60~180 | °C | - |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 5.0 | W/m·K | ASTM D5470 |
| Thermal impedance@10 psi | 0.398 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.287 | °C-in²/ W | ASTM D5470 |
Related Products
S282-s
2.5 W/m·K
Shore OO/18
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5.0 W/m·K
Shore OO/25