RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Thermal Filler

Silicone-based thermal liquid gap fillers offer low stress, high thermal conductivity, and low viscosity compared to traditional thermal pads. They maintain insulation properties with a thermal conductivity coefficient of 2.2-7.0 W/m*K, making them ideal for automated dispensing processes with LiPOLY's putty-specific smart machines.

Dispensing Robot
PK700DM
7.0 W/m*K
Fast Curing in room temperature
PK605DM
5.0 W/m*K
Fast Curing in room temperature
PK404DM
3.6 W/m*K
Fast Curing in room temperature
PK223DM
2.2 W/m*K
Fast Curing in room temperature
PK223DM
2.2 W/m*K
Fast Curing in room temperature
PK404DM
3.6 W/m*K
Fast Curing in room temperature
PK605DM
5.0 W/m*K
Fast Curing in room temperature
PK700DM
7.0 W/m*K
Fast Curing in room temperature
PK700DM
7.0 W/m*K
Fast Curing in room temperature
PK605DM
5.0 W/m*K
Fast Curing in room temperature
PK404DM
3.6 W/m*K
Fast Curing in room temperature
PK223DM
2.2 W/m*K
Fast Curing in room temperature

熱介面管理專家

LiPOLY® Advance TIMs

桃園市八德區永豐路435號

CONTACT