RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Thermal Putty

Thermal putty is a material designed for efficient heat conduction, primarily used to fill gaps between PCB components and heat sinks, ensuring effective heat transfer and preventing overheating. It is commonly used in thermal management for electronic components. As a high thermal conductivity material, it can fill uneven surfaces and remain fixed long-term without peeling off, making it the best choice for larger gap applications.

Thermal Putty
Lightweight thermal putty is a low-density, lightweight thermal material commonly used in lightweight drones and EV (electric vehicle) components. For lightweight drones, reducing weight can directly extend flight endurance, as battery weight accounts for a large proportion; lowering the weight effectively improves the endurance per unit of electrical energy. In electric vehicles, lightweight design also reduces energy consumption and increases battery range.
DTT13-s
13.0 W/m*K
No Vertical Flow
Thermal putty features a softness and hardness level between thermal grease and thermal pads. It offers greater durability than thermal grease and better conformability than thermal pads. Its soft texture makes it easy to apply and fill, providing excellent plasticity to accommodate uneven surfaces and eliminate air gaps. Additionally, thermal putty is nearly non-hardening, so it does not introduce internal stress to equipment after application, and it is easier to handle compared to thermal grease.
S-putty5-s
10.0 W/m*K
No Vertical Flow
Lightweight thermal gel combines high thermal conductivity with lightweight properties. Its low-density characteristic helps reduce production costs and energy consumption while enhancing product performance. The high compressibility and tolerance compensation features allow it to fill gaps around electronic components, ensuring close contact with heat sinks and thus improving heat transfer efficiency. These advantages make it an ideal thermal management material for applications such as electronics and electric vehicles.
DTT10-s
10.0 W/m*K
No Vertical Flow
Thermal gel, compared to thermal grease, features non-flowing and anti-sagging properties, making it easier to clean. It can replace thermal pads and offers characteristics such as low oil bleed and non-flowing behavior. Thermal gel can fill larger gaps and simultaneously encapsulate various irregular components, maintaining stability even at high temperatures. Additionally, it provides higher dielectric breakdown voltage insulation, making it suitable for high-power electronic and electrical components.
SH-putty3
8.0 W/m*K
No Vertical Flow
Thermal silicone putty is a polymer thermal interface material made with a silicone base and added thermal conductive fillers. It offers both electrical insulation and mechanical protection, efficiently transferring and dissipating heat. Thermal silicone is primarily used for thermal management and heat dissipation in industries such as electronics, electrical engineering, automotive, and lighting. Due to its high thermal conductivity, insulation, softness, and high-temperature resistance, thermal silicone has become an indispensable material for thermal management in modern electronic and electrical products.
S-putty2-s
6.0 W/m*K
No Vertical Flow
Thermal putty is primarily used to fill gaps between electronic components and heat sinks, enhancing heat dissipation efficiency. It effectively conducts heat, rapidly transferring the heat generated by components to the heat sink, thereby lowering component temperatures and preventing overheating damage. Thermal putty overcomes issues such as overflow and drying out commonly seen with thermal grease, and is an ideal choice for automated dispensing production when used with LiPOLY’s dedicated putty dispensing equipment.
H-putty2
6.0 W/m*K
No Vertical Flow
The DTT04-s is a Low-density thermal putty. Its lightweight properties reduce production costs, and minimize material usage and energy consumption. It is commonly used in electronic products and automotive electronic devices. With a thermal conductivity of 4.0 W/m*K, this product offers high deformability, allowing flexible adaptation to various gaps and providing tolerance compensation. It effectively addresses issues such as overflow and drying, improves heat transfer, and is suitable for automated dispensing production.
DTT06-s
6.0 W/m*K
No Vertical Flow
DTT04-s 系列是一種低密度的凝膠填縫材料。低密度、輕量化特性，可為產品提高其性能、降低生產成本及減少材料的使用和能源消耗等，常被應用在電子產品及汽車電子設備上。產品導熱係數4.0 -10.0 W/m*K，具有高變形量，可靈活性的適配間隙，兼具公差補償特性.可克服溢流乾凅問題, 提高熱傳導，適合自動化點膠生產。
DTT04-s
4.0 W/m*K
No Vertical Flow
Thermal gel is a type of thermal interface material (TIM) used to fill microscopic gaps between electronic components-such as CPUs and GPUs-and heat sinks. By efficiently conducting heat, thermal gel helps reduce component temperatures, prevents overheating and performance degradation, and is an ideal choice for automated dispensing production using LiPOLY’s dedicated putty smart machine.
S-putty
3.5 W/m*K
No Vertical Flow
Silicone thermal putty is a thermal interface material made from a silicone base combined with thermally conductive powders, blended using specialized equipment. It offers excellent thermal conductivity, insulation, and high-temperature resistance. Widely used in electronics, automotive, and LED industries, it enhances heat dissipation efficiency and extends product lifespan by effectively transferring heat from heat-generating components to heat sinks.
H-putty
3.5 W/m*K
No Vertical Flow
DTT04-s 系列是一種低密度的凝膠填縫材料。低密度、輕量化特性，可為產品提高其性能、降低生產成本及減少材料的使用和能源消耗等，常被應用在電子產品及汽車電子設備上。產品導熱係數4.0 -10.0 W/m*K，具有高變形量，可靈活性的適配間隙，兼具公差補償特性.可克服溢流乾凅問題, 提高熱傳導，適合自動化點膠生產。
DTT04-s
4.0 W/m*K
No Vertical Flow
The DTT04-s is a Low-density thermal putty. Its lightweight properties reduce production costs, and minimize material usage and energy consumption. It is commonly used in electronic products and automotive electronic devices. With a thermal conductivity of 4.0 W/m*K, this product offers high deformability, allowing flexible adaptation to various gaps and providing tolerance compensation. It effectively addresses issues such as overflow and drying, improves heat transfer, and is suitable for automated dispensing production.
DTT06-s
6.0 W/m*K
No Vertical Flow
Lightweight thermal gel combines high thermal conductivity with lightweight properties. Its low-density characteristic helps reduce production costs and energy consumption while enhancing product performance. The high compressibility and tolerance compensation features allow it to fill gaps around electronic components, ensuring close contact with heat sinks and thus improving heat transfer efficiency. These advantages make it an ideal thermal management material for applications such as electronics and electric vehicles.
DTT10-s
10.0 W/m*K
No Vertical Flow
Lightweight thermal putty is a low-density, lightweight thermal material commonly used in lightweight drones and EV (electric vehicle) components. For lightweight drones, reducing weight can directly extend flight endurance, as battery weight accounts for a large proportion; lowering the weight effectively improves the endurance per unit of electrical energy. In electric vehicles, lightweight design also reduces energy consumption and increases battery range.
DTT13-s
13.0 W/m*K
No Vertical Flow
Silicone thermal putty is a thermal interface material made from a silicone base combined with thermally conductive powders, blended using specialized equipment. It offers excellent thermal conductivity, insulation, and high-temperature resistance. Widely used in electronics, automotive, and LED industries, it enhances heat dissipation efficiency and extends product lifespan by effectively transferring heat from heat-generating components to heat sinks.
H-putty
3.5 W/m*K
No Vertical Flow
Thermal putty is primarily used to fill gaps between electronic components and heat sinks, enhancing heat dissipation efficiency. It effectively conducts heat, rapidly transferring the heat generated by components to the heat sink, thereby lowering component temperatures and preventing overheating damage. Thermal putty overcomes issues such as overflow and drying out commonly seen with thermal grease, and is an ideal choice for automated dispensing production when used with LiPOLY’s dedicated putty dispensing equipment.
H-putty2
6.0 W/m*K
No Vertical Flow
Thermal gel is a type of thermal interface material (TIM) used to fill microscopic gaps between electronic components-such as CPUs and GPUs-and heat sinks. By efficiently conducting heat, thermal gel helps reduce component temperatures, prevents overheating and performance degradation, and is an ideal choice for automated dispensing production using LiPOLY’s dedicated putty smart machine.
S-putty
3.5 W/m*K
No Vertical Flow
Thermal silicone putty is a polymer thermal interface material made with a silicone base and added thermal conductive fillers. It offers both electrical insulation and mechanical protection, efficiently transferring and dissipating heat. Thermal silicone is primarily used for thermal management and heat dissipation in industries such as electronics, electrical engineering, automotive, and lighting. Due to its high thermal conductivity, insulation, softness, and high-temperature resistance, thermal silicone has become an indispensable material for thermal management in modern electronic and electrical products.
S-putty2-s
6.0 W/m*K
No Vertical Flow
Thermal putty features a softness and hardness level between thermal grease and thermal pads. It offers greater durability than thermal grease and better conformability than thermal pads. Its soft texture makes it easy to apply and fill, providing excellent plasticity to accommodate uneven surfaces and eliminate air gaps. Additionally, thermal putty is nearly non-hardening, so it does not introduce internal stress to equipment after application, and it is easier to handle compared to thermal grease.
S-putty5-s
10.0 W/m*K
No Vertical Flow
Thermal gel, compared to thermal grease, features non-flowing and anti-sagging properties, making it easier to clean. It can replace thermal pads and offers characteristics such as low oil bleed and non-flowing behavior. Thermal gel can fill larger gaps and simultaneously encapsulate various irregular components, maintaining stability even at high temperatures. Additionally, it provides higher dielectric breakdown voltage insulation, making it suitable for high-power electronic and electrical components.
SH-putty3
8.0 W/m*K
No Vertical Flow
Lightweight thermal putty is a low-density, lightweight thermal material commonly used in lightweight drones and EV (electric vehicle) components. For lightweight drones, reducing weight can directly extend flight endurance, as battery weight accounts for a large proportion; lowering the weight effectively improves the endurance per unit of electrical energy. In electric vehicles, lightweight design also reduces energy consumption and increases battery range.
DTT13-s
13.0 W/m*K
No Vertical Flow
Thermal putty features a softness and hardness level between thermal grease and thermal pads. It offers greater durability than thermal grease and better conformability than thermal pads. Its soft texture makes it easy to apply and fill, providing excellent plasticity to accommodate uneven surfaces and eliminate air gaps. Additionally, thermal putty is nearly non-hardening, so it does not introduce internal stress to equipment after application, and it is easier to handle compared to thermal grease.
S-putty5-s
10.0 W/m*K
No Vertical Flow
Lightweight thermal gel combines high thermal conductivity with lightweight properties. Its low-density characteristic helps reduce production costs and energy consumption while enhancing product performance. The high compressibility and tolerance compensation features allow it to fill gaps around electronic components, ensuring close contact with heat sinks and thus improving heat transfer efficiency. These advantages make it an ideal thermal management material for applications such as electronics and electric vehicles.
DTT10-s
10.0 W/m*K
No Vertical Flow
Thermal gel, compared to thermal grease, features non-flowing and anti-sagging properties, making it easier to clean. It can replace thermal pads and offers characteristics such as low oil bleed and non-flowing behavior. Thermal gel can fill larger gaps and simultaneously encapsulate various irregular components, maintaining stability even at high temperatures. Additionally, it provides higher dielectric breakdown voltage insulation, making it suitable for high-power electronic and electrical components.
SH-putty3
8.0 W/m*K
No Vertical Flow
Thermal silicone putty is a polymer thermal interface material made with a silicone base and added thermal conductive fillers. It offers both electrical insulation and mechanical protection, efficiently transferring and dissipating heat. Thermal silicone is primarily used for thermal management and heat dissipation in industries such as electronics, electrical engineering, automotive, and lighting. Due to its high thermal conductivity, insulation, softness, and high-temperature resistance, thermal silicone has become an indispensable material for thermal management in modern electronic and electrical products.
S-putty2-s
6.0 W/m*K
No Vertical Flow
Thermal putty is primarily used to fill gaps between electronic components and heat sinks, enhancing heat dissipation efficiency. It effectively conducts heat, rapidly transferring the heat generated by components to the heat sink, thereby lowering component temperatures and preventing overheating damage. Thermal putty overcomes issues such as overflow and drying out commonly seen with thermal grease, and is an ideal choice for automated dispensing production when used with LiPOLY’s dedicated putty dispensing equipment.
H-putty2
6.0 W/m*K
No Vertical Flow
The DTT04-s is a Low-density thermal putty. Its lightweight properties reduce production costs, and minimize material usage and energy consumption. It is commonly used in electronic products and automotive electronic devices. With a thermal conductivity of 4.0 W/m*K, this product offers high deformability, allowing flexible adaptation to various gaps and providing tolerance compensation. It effectively addresses issues such as overflow and drying, improves heat transfer, and is suitable for automated dispensing production.
DTT06-s
6.0 W/m*K
No Vertical Flow
DTT04-s 系列是一種低密度的凝膠填縫材料。低密度、輕量化特性，可為產品提高其性能、降低生產成本及減少材料的使用和能源消耗等，常被應用在電子產品及汽車電子設備上。產品導熱係數4.0 -10.0 W/m*K，具有高變形量，可靈活性的適配間隙，兼具公差補償特性.可克服溢流乾凅問題, 提高熱傳導，適合自動化點膠生產。
DTT04-s
4.0 W/m*K
No Vertical Flow
Thermal gel is a type of thermal interface material (TIM) used to fill microscopic gaps between electronic components-such as CPUs and GPUs-and heat sinks. By efficiently conducting heat, thermal gel helps reduce component temperatures, prevents overheating and performance degradation, and is an ideal choice for automated dispensing production using LiPOLY’s dedicated putty smart machine.
S-putty
3.5 W/m*K
No Vertical Flow
Silicone thermal putty is a thermal interface material made from a silicone base combined with thermally conductive powders, blended using specialized equipment. It offers excellent thermal conductivity, insulation, and high-temperature resistance. Widely used in electronics, automotive, and LED industries, it enhances heat dissipation efficiency and extends product lifespan by effectively transferring heat from heat-generating components to heat sinks.
H-putty
3.5 W/m*K
No Vertical Flow

熱介面管理專家

LiPOLY® Advance TIMs

桃園市八德區永豐路435號

CONTACT