RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Non-silicone Liquid Gap Filler

Non-silicone liquid thermal interface material is a liquid or semi-liquid thermal conductive material that does not contain siloxane, mainly used for thermal management of high-precision electronic components or optical devices. It features excellent thermal conductivity and conformability, effectively filling the gaps between heat-generating components and heat sinks, while avoiding the issues of volatilization, contamination, or outgassing that may occur with traditional silicone-based materials.

Thermal Putty
NEP220
2.2 W/m·K
Low outgassing
G3380NA
1.3 W/m·K
Low outgassing
NEP220
2.2 W/m·K
Low outgassing
G3380NA
1.3 W/m·K
Low outgassing
NEP220
2.2 W/m·K
Low outgassing
G3380NA
1.3 W/m·K
Low outgassing

Thermal Solutions Expert

LiPOLY® Advance TIMs

Taoyuan City, Bade District, Yongfeng Road, No. 435

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