FEATURES
/ Thermal conductivity: 6.0 W/m·K
/ Excellent absorption characteristics
/ Naturally tacky for ease of manufacture
/ Reworkable
CONFIGURATIONS
/ Sheets form
/ Die-cuts parts
Attenuation
NEW Product
Thermal EMI Absorption
A Thermally Conductive EMI Absorption Pad is a composite material that combines high-efficiency heat dissipation and electromagnetic wave absorption capabilities. It fills thermal interface gaps between electronic components and heat sinks, while its absorber layer reduces reflection and resonance within specific frequency bands to suppress electromagnetic interference (EMI)。
TYPICAL APPLICATION
/ IC, CPU, MOS, LED, M/B, Heat sink
/ LCD-TV, Notebook PC, PC, Telecom device, Wireless hub
/ DDR II module, DVD applications, Hand-set applications
/ 5G base station & infrastructure
// 2.4 GHz Wi-Fi Router , Bluetooth
// 3.5 GHz 5G Mobile Networks
// 5.0 GHz Wi-Fi Router
// 12~18 GHz Low Earth Orbit (LEO) System
// 28 GHz 5G Mobile Networks
// 39 GHz 5G Mobile Networks
TYPICAL PROPERTIES
| PROPERTY | Thermal EMI Absorption | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Dark Gray | - | Visual |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.8 | g/cm³ | ASTM D792 |
| Hardness | 75 | Shore OO | ASTM D2240 |
| TML | 0.04 | % | By LiPOLY |
| Water absorption | 0.04 | % | ASTM D570 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 6.0 | W/m*K | ASTM D5470 |
| Thermal impedance@10 psi | 0.288 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.250 | °C-in²/ W | ASTM D5470 |
