液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
電子封膠（Encapsulation Resin）是指在電子產品組裝過程中，用於覆蓋、保護和固定電子元件的聚合物材料。這種封裝材料在提高電子產品的可靠性、耐用性以及防護性能方面起著至關重要的作用。
CATEGORY
FEATURES
/ Thermal conductivity: 0.8 W/m*K
/ Two-parts package and easy to use
/ Waterproof and air-tight
/ Thermally conductive vibration dampening
SPECIFICATIONS
/ TPS589 The principle of moisture hardening is to harden by reacting with moisture in the air at room temperature. The hardening process starts from the surface in contact with the air and hardens in the deep direction, so the hardening process is a little slow. The speed of hardening is related to temperature and humidity. When there is not enough water vapor in the use environment to react, it may not be completely hardened.
TYPICAL APPLICATION
/ Automotive electronics
/ Telecommunications
/ Computer and peripherals
/ Between any heat-generating component and a heat sink
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | TPS589 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | White | - | Visual |
| Resin base | Silicone | - | - |
| A:B | 100:3 | - | - |
| Viscosity | 5.0 | Pa.s | ISO 3219 |
| Density | 1.8 | g/cm³ | ASTM D792 |
| Application temperature | -60~180 | °C | - |
| Hardness | 50 | Shore A | ASTM D2240 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 0.8 | W/m*K | ASTM D5470 |
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