液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
TPS5868
3.0 W/m·K
Sealing Glue
導熱灌封膠（又稱導熱封裝膠）是一種具有優異流動性和導熱性的液態漿料，可以覆蓋及填補電子元件模組之間隙，旨在增強散熱效果並提供電氣絕緣，以保護元件免受環境損害。經由室溫固化後的導熱灌封膠，可發揮防塵、防潮、防震、絕緣及導熱的功能。廣泛應用於LED模組、電源模組和汽車電子等領域。
TPS5868 是可以在室溫或高溫下固化雙劑導熱灌封膠，灌封膠是液體流動性導熱膠，可填滿電子器件周圍空氣空間的縫隙，固化後與發熱的電子元件和散熱器保持密切接觸，使電子產品能夠在高功率下運行進行熱傳導，熱傳導係數：3.0 W/m*K的間隙填充材料。
CATEGORY
Sealing Glue
FEATURES
/ Thermal conductivity: 3.0 W/m*K
/ Two-parts package and easy to use
/ Waterproof and air-tight
/ Thermally conductive vibration dampening
SPECIFICATIONS
/TPS5868 If the interface has organic compounds such as Nitrogen, Phosphorous, Sulfur etc., and heavy metals ionic compound such as Tin, Lead, Mercury, Antimony, Bismuth, Arsenic etc., and Organometallic-salts etc., which will cause the gel incomplete curving even will be non-curved.
TYPICAL APPLICATION
/ Automotive electronics
/ Telecommunications
/ Computer and peripherals
/ 5G base station & infrastructure
/ Between any heat-generating component and a heat sink
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | TPS5868 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | White-A Gray-B | - | Visual |
| Resin base | Silicone | - | - |
| A:B | 100:100 | - | - |
| Viscosity | 8.0 | Pa.s | ISO 3219 |
| Density | 2.8 | g/cm³ | ASTM D792 |
| Application temperature | -60~180 | °C | - |
| Hardness | 5 | Shore A | ASTM D2240 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 3.0 | W/m*K | ASTM D5470 |
| Dielectric breakdown | 14 | KV/mm | ASTM D149 |
| Volume resistivity | >10¹² | Ohm-m | ASTM D257 |
Related Product
TPS589
0.8 W/m·K
Sealing Glue
TPS586
1.5 W/m·K
Sealing Glue
TPS32
1.5 W/m·K
Sealing Glue
TPS31
0.55 W/m·K
Sealing Glue