液体
シート
吸収
テープ
絶縁
黒鉛
軽量
断熱
導熱灌封膠 ——
TPS5868
3.0 W/m*K
導熱灌封膠是一種具有良好流動性和導熱性能的液態漿料，透過將液態膠體澆灌並固化於電子組件之間，可填滿電子器件周圍空氣空間的縫隙，形成長期且有效的防護層，可達到防水、防潮、耐震、電氣絕緣和保護關鍵線束等多重效果。
TPS5868 是可以在室溫或高溫下固化雙劑導熱灌封膠，灌封膠是液體流動性導熱膠，可填滿電子器件周圍空氣空間的縫隙，固化後與發熱的電子元件和散熱器保持密切接觸，使電子產品能夠在高功率下運行進行熱傳導，熱傳導係數：3.0 W/m*K的間隙填充材料。CATEGORY
FEATURES
/ Thermal conductivity: 3.0 W/m*K
/ Two-parts package and easy to use
/ Waterproof and air-tight
/ Thermally conductive vibration dampening
SPECIFICATIONS
/TPS5868 If the interface has organic compounds such as Nitrogen, Phosphorous, Sulfur etc., and heavy metals ionic compound such as Tin, Lead, Mercury, Antimony, Bismuth, Arsenic etc., and Organometallic-salts etc., which will cause the gel incomplete curving even will be non-curved.
TYPICAL APPLICATION
/ Automotive electronics
/ Telecommunications
/ Computer and peripherals
/ 5G base station & infrastructure
/ Between any heat-generating component and a heat sink
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | TPS5868 | TEST METHOD | UNIT |
|---|---|---|---|
| Color | White-A Gray-B | Visual | - |
| Resin base | Silicone | - | - |
| A:B | 100:100 | - | - |
| Viscosity | 8.0 | ISO 3219 | Pa.s |
| Density | 2.8 | ASTM D792 | g/cm³ |
| Application temperature | -60~180 | - | °C |
| Hardness | 5 | ASTM D2240 | Shore A |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 3.0 | ASTM D5470 | W/m*K |
| Dielectric breakdown | 14 | ASTM D149 | KV/mm |
| Volume resistivity | >10¹² | ASTM D257 | Ohm-m |