RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
TPS586
1.5 W/m*K
TPS586 是可以在室溫或高溫下固化雙劑導熱灌封膠,灌封膠是液體流動性導熱膠,可填滿電子器件周圍空氣空間的縫隙,固化後與發熱的電子元件和散熱器保持密切接觸,使電子產品能夠在高功率下運行進行熱傳導,熱傳導係數:1.5 W/m*K的間隙填充材料。

CATEGORY

Thermal Putty

FEATURES

/ Thermal conductivity: 1.5 W/m*K
/ Two-parts package and easy to use
/ Waterproof and air-tight
/ Thermally conductive vibration dampening

PRECAUTIONS

/ TPS586 If the interface has organic compounds such as Nitrogen, Phosphorous, Sulfur etc., and heavy metals ionic compound such as Tin, Lead, Mercury, Antimony, Bismuth, Arsenic etc., and Organometallic-salts etc., which will cause the gel incomplete curving even will be non-curved.

TYPICAL APPLICATION

/ Automotive electronics
/ Telecommunications
/ Computer and peripherals
/ 5G base station & infrastructure
/ Between any heat-generating component and a heat sink
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY TPS586 TEST METHOD UNIT
Color White-A Gray-B Visual -
Resin base Silicone - -
A:B 100:100 - -
Viscosity 5.7 ISO 3219 Pa.s
Density 2.3 ASTM D792 g/cm³
Application temperature -60~180 - °C
Hardness 10 ASTM D2240 Shore A
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 1.5 ASTM D5470 W/m*K
Dielectric breakdown 14 ASTM D149 KV/mm
Volume resistivity >10¹² ASTM D257 Ohm-m

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