RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

導熱液態系列

導熱液態膠(Thermal Liquid Gap Filler)是一種高流動性、高導熱性的填充材料,專為填補電子元件與散熱模組之間的空隙而設計。相較於傳統導熱墊片,液態膠可完全覆蓋不規則表面,確保更佳的熱傳導效果,適用於電動車電池模組、伺服器、LED 照明設備等高散熱需求的應用。

導熱填隙劑

G3380A
1.3 W/m*K
Low minimum bond line
TPS589
0.8 W/m*K
Sealing Glue
TPS31
0.55 W/m*K
Sealing Glue
H-putty
3.5 W/m*K
No Vertical Flow
N-putty-s
3.5 W/m*K
Low outgassing
G3380NJ
3.2 W/m*K
Low outgassing
G3380B
3.2 W/m*K
Low minimum bond line
NEP230
3.0 W/m*K
Low outgassing
TPS5868
3.0 W/m*K
Sealing Glue
EP770-s
2.5 W/m*K
Low outgassing
PK223DM
2.2 W/m*K
Fast Curing in room temperature
NEP220
2.2 W/m*K
Low outgassing
D2000
2.0 W/m*K
Never Pump-out and Dry
TIM12
2.0 W/m*K
No freeze preservation required
TPS32
1.5 W/m*K
Sealing Glue

For all informaton you need

CALL US: 03-3788588

熱介面管理專家

旭立科技股份有限公司

桃園市八德區永豐路435號

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