RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

導熱液態系列

導熱液態膠(Thermal Liquid Gap Filler)是一種高流動性、高導熱性的填充材料,專為填補電子元件與散熱模組之間的空隙而設計。相較於傳統導熱墊片,液態膠可完全覆蓋不規則表面,確保更佳的熱傳導效果,適用於電動車電池模組、伺服器、LED 照明設備等高散熱需求的應用。

導熱填隙劑

DTT04-s
4.0 W/m*K
No Vertical Flow
TIM14
4.0 W/m*K
No freeze preservation required
PK404DM
3.6 W/m*K
Fast Curing in room temperature
H-putty
3.5 W/m*K
No Vertical Flow
S-putty
3.5 W/m*K
No Vertical Flow
G3380B
3.2 W/m*K
Low minimum bond line
TPS5868
3.0 W/m*K
Sealing Glue
PK223DM
2.2 W/m*K
Fast Curing in room temperature
TIM12
2.0 W/m*K
No freeze preservation required
D2000
2.0 W/m*K
Never Pump-out and Dry
TPS586
1.5 W/m*K
Sealing Glue
TPS32
1.5 W/m*K
Sealing Glue
NEP220
2.2 W/m*K
Low outgassing
G3380NA
1.3 W/m*K
Low outgassing
DTT06-s
6.0 W/m*K
No Vertical Flow
H-putty2
6.0 W/m*K
No Vertical Flow
TT3000
6.0 W/m*K
Nano Thermal Grease
PK605DM
5.0 W/m*K
Fast Curing in room temperature
N-putty2-s
5.0 W/m*K
Low outgassing
G3380NK
4.5 W/m*K
Low outgassing
G3380K
4.5 W/m*K
Low minimum bond line
NL-putty04-s
4.0 W/m*K
Low outgassing
DTT04-s
4.0 W/m*K
No Vertical Flow
TIM14
4.0 W/m*K
No freeze preservation required
PK404DM
3.6 W/m*K
Fast Curing in room temperature
S-putty
3.5 W/m*K
No Vertical Flow

For all informaton you need

CALL US: 03-3788588

熱介面管理專家

旭立科技股份有限公司

桃園市八德區永豐路435號

CONTACT