Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
NEP230
3.0 W/m·K
Low outgassing
NEP230 is a non-silicone thermal gap filling adhesive that combines both thermal conductivity and bonding functions. It can cure at room temperature or elevated temperatures to provide strong fixation. Compared to thermal pads, thermal adhesives not only apply lower stress to components but also maintain insulation properties.
CATEGORY
Thermal Putty
FEATURES
/ Thermal conductivity: 3.0 W/m·K
/ Suitable for automatic dispensing machine
/ Room Temperature curing or heating curing
/ Low compression stress during assembly
/ Excellent adhesion to metal & PCB
CONFIGURATIONS
/ Cartridges: 50ml, 400ml
/ Other special and custom sizes are available upon request
TYPICAL APPLICATION
/ Electronic components: IC、CPU MOS、Mother Board、Wireless Hub Telecom Device 、Automotive electronics、Computer 、 Peripherals and High frequency magnetic inductor
/ Between any heat-generating component and a heat sink
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | NEP230 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray-A Black-B | - | Visual |
| Resin Base | Epoxy | - | - |
| A:B | 100:100 | - | - |
| Viscosity A | 270 | Pa.s | ISO 3219 |
| Viscosity B | 240 | Pa.s | ISO 3219 |
| Hardness | 90 | Shore A | ASTM D2240 |
| Tensile strength | 60 | N/cm² | ISO527 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 3.0 | W/m·K | ISO 22007-2 |
| Dielectric breakdown | 14 | KV/mm | ASTM D149 |
| Volume resistivity | >10¹¹ | Ohm-m | ASTM D257 |
Related Products
NEP230
3.0 W/m·K
Low outgassing
NEP220
2.2 W/m·K
Low outgassing