RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
NEP230
3.0 W/m*K
Low outgassing
NEP230 is a non-silicone thermal gap filling adhesive that combines both thermal conductivity and bonding functions. It can cure at room temperature or elevated temperatures to provide strong fixation. Compared to thermal pads, thermal adhesives not only apply lower stress to components but also maintain insulation properties. With zero low-molecular-weight siloxane volatility, it does not cause electrical contact failure, making it suitable for use in optical products or sensitive electronic components.

CATEGORY

Thermal Putty

FEATURES

/ Thermal conductivity: 3.0 W/m*K
/ Can be applied with dispenser
/ Room Temperature curing or heating curing
/ Low compression stress during assembly
/ Excellent adhesion to metal & PCB

CONFIGURATIONS

/ Cartridges:50ml, 400ml
/ Other special and custom sizes are available upon request

TYPICAL APPLICATION

/ Electronic components: IC、CPU MOS、Mother Board、Wireless Hub Telecom Device 、Automotive electronics、Computer 、 Peripherals and High frequency magnetic inductor
/ Between any heat-generating component and a heat sink.
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY NEP230 UNIT TEST METHOD
Color Gray-A Black-B - Visual
Resin base Epoxy - -
A:B 100:100 - -
Viscosity A 270 Pa.s ISO 3219
Viscosity B 240 Pa.s ISO 3219
Hardness 90 Shore A ASTM D2240
Tensile strength 60 N/cm² ISO527
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 3.0 W/m*K ISO 22007-2
Dielectric breakdown 14 KV/mm ASTM D149
Volume resistivity >10¹¹ Ohm-m ASTM D257

Related​ Product

NEP230
3.0 W/m*K
Low outgassing

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