NEP230
3.0 W/m*K
Low outgassing
Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
NEP220
2.2 W/m*K
Low outgassing
Thermal conductive Adhesive is a type of adhesive with excellent thermal conductivity commonly used to bond electronic components and heat sinks. It effectively fills gaps between components, ensuring efficient heat transfer. Unlike thermal paste, thermal adhesive has stickiness and can bond two surfaces together, providing mechanical fixation without the need for additional fasteners.
CATEGORY
Thermal Putty
FEATURES
/ Thermal conductivity: 2.2 W/m*K
/ Can be applied with dispenser
/ Room Temperature curing or heating curing
/ Low compression stress during assembly
/ Excellent adhesion to metal & PCB
CONFIGURATIONS
/ Cartridges:50ml, 400ml
/ Other special and custom sizes are available upon request
TYPICAL APPLICATION
/ Electronic components: IC、CPU MOS、Mother Board、Wireless Hub Telecom Device 、Automotive electronics、Computer 、 Peripherals and High frequency magnetic inductor
/ Between any heat-generating component and a heat sink.
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | NEP220 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray-A Black-B | - | Visual |
| Resin base | Epoxy | - | - |
| A:B | 100:100 | - | - |
| Viscosity A/B | 265 / 252 | Pa.s | ISO 3219 |
| Density | 2.7 | g/cm³ | ASTM D792 |
| Hardness | 90 | Shore A | ASTM D2240 |
| Tensile strength | 65 | N/cm² | ISO527 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 2.2 | W/m*K | ISO 22007-2 |
| Dielectric breakdown | 14 | KV/mm | ASTM D149 |
| Volume resistivity | >10¹¹ | Ohm-m | ASTM D257 |
Related Product
NEP220
2.2 W/m*K
Low outgassing