Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
EP770-s
2.5 W/m*K
Low outgassing
PCB encapsulation resin is a protective material used to coat or encase printed circuit boards (PCBs). This process, also known as potting, safeguards PCBs from environmental hazards like moisture, vibration, shock, and contaminants. The resin creates a barrier, enhancing the PCB's reliability and lifespan.
CATEGORY
Sealing Glue
FEATURES
/ Thermal conductivity: 2.5 W/m*K
/ Thermally conductive vibration dampening
/ Low mixing viscosity
/ Extremely low Shrinkage rate 0.01%.
/ Epoxy Based material with high hardness for support
/ Slow sedimentation rate due to Resin & powder mixing perfectly via superb processing technology. It leads EP770-s material easy to mix and disperse
CONFIGURATIONS
/ Tinplate Can:1 kg
/ Other special and custom sizes are available upon request
TYPICAL APPLICATION
/ Motor: Torque motor、Linear Motor Servo motor
/ IGBT module
/ Electronic components: IC、CPU、MOS、Mother Board
/ Wireless Hub
/ Automotive electronics
/ Between any heat-generating component and a heat sink
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | EP770-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Black | - | Visual |
| Resin base | Epoxy | - | - |
| A:B | 100:10 | - | - |
| Viscosity A | 350 | Pa.s | ISO 3219 |
| Viscosity mixed | 5 | Pa.s | ISO 3219 |
| Hardness (AFTER CURE) | 80 | Sore A | ASTM D2240 |
| Tensile strength | 73 | N/cm² | ISO527 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 2.5 | W/m*K | ASTM D5470 |
| Dielectric breakdown | 14 | KV/mm | ASTM D149 |
| Volume resistivity | >10¹¹ | Ohm-m | ASTM D257 |
Related Product
EP770-s
2.5 W/m*K
Low outgassing